Team Group MP33 TM8FP6256G0C101 256GB M.2 2280 internal SSD
- Internal Solid Stat…
- Consumer
Team Group
A 1 TB M.2 2280 NVMe 1.3 drive using 3D NAND and PCIe 3.0 x4, reaching 1800 MB/s read and 1500 MB/s write with 240 TBW endurance
Options 1TB MP33
The Team Group MP33 is a 1TB M.2 2280 NVMe 1.3 drive that uses PCIe 3.0 x4 and 3D NAND flash. It targets desktop and notebook owners who want a straightforward capacity boost without moving to a newer interface generation. The DRAM-less design relies on Host Memory Buffer to keep controller overhead low. It fits any platform with an M-key slot that supports PCIe 3.0.
Installation requires a motherboard or laptop with an M.2 2280 M-key connector wired for PCIe 3.0 x4 and NVMe 1.3 support. No heatsink or extra power cable is needed because the controller draws modest power through the slot. The single-sided 2280 PCB leaves room for a board-mounted thermal pad if the chassis runs warm. It frees a 2.5-inch bay for mass storage or a second drive.
Rated at 240 TBW and 1.5 million hours MTBF, the drive handles operating-system drives, game libraries and light creative workloads comfortably. Sequential speeds reach 1800 MBps read and 1500 MBps write while random performance tops out at 220000 read and 200000 write IOPS. Sustained heavy writes will eventually hit the SLC cache limit and throttle to native NAND speed.
| Brand | Team Group |
|---|---|
| Series | MP33 |
| Model | TM8FP6001T0C101 |
| Device Type | Internal Solid State Drive (SSD) |
| Used For | Consumer |
| Form Factor | M.2 2280 |
| Capacity | 1TB |
| Memory Components | 3D NAND |
| Interface | PCIe 3.0 x4 with NVMe 1.3 |
| Protocol | NVMe 1.3 |
| Cache | No DRAM (HMB) |
| Max Sequential Read | Up to 1800 MBps |
| Max Sequential Write | Up to 1500 MBps |
| 4KB Random Read | Up to 220,000 IOPS |
| 4KB Random Write | Up to 200,000 IOPS |
| Terabytes Written (TBW) | 240TB |
| MTBF | 1,500,000 hours |
| Features | Using new generation of 3D flash memory: Capacity, performance, and durability are greatly improved PCI-e interface - Supports latest NVMe 1.3 protocol M.2 2280 specification: Supports the next-generation platforms of Intel and AMD. Suitable for both desktop and notebook Supports SLC Caching technology. Greatly enhance computing performance |
| Operating Temperature | 0°C ~ +70°C |
| Storage Temperature | -40°C ~ +85°C |
| Operating Humidity | RH 90% under 40 celsius degree |
| Max Shock Resistance | 1,500G / 0.5 ms |
| Max Vibration Resistance | 80-2,000 Hz / 20G |
| Height | 3.80mm |
| Width | 22.00mm |
| Depth | 80.00mm |
| Weight | 6.00g |
| 배송 무게 | 0.02 kg |
| 포장 크기 | 122 × 90 × 8 mm |
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The operating range tops out at 70°C; sustained writes that push the controller to this limit will trigger thermal throttling to protect the NAND.
As a DRAM-less PCIe 3.0 x4 drive it typically stays under 5 W, runs cool in the M.2 2280 slot and does not require a heatsink for normal workloads.
An M.2 2280 key-M slot wired for PCIe 3.0 x4 with NVMe 1.3 support in the BIOS is all that is needed; no extra cables or adapters are required.
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