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ASUS EX-B860M-V5/SI mATX motherboard with Intel Ultra 9 285K CPU and Shin-Etsu thermal paste

ASUS

ASUS EX-B860M-V5/SI Intel motherboard & Ultra 9 285K combo

SKU CH-2X2V-R3Q4H

A B860 mATX motherboard paired with a 285K processor and Shin-Etsu thermal paste, offering DDR5 memory, PCIe 4.0 slots, SATA 6 Gbps, 2.5G LAN, and moisture-resistant coating for stable gaming

  • CPU Socket TypeLGA 1851

model EX-B860M-V5/SI

Pokaż jeszcze 3 konfiguracji

+CPU +Ultra 9 285K

  • Ready-to-build combo with CPU, motherboard and thermal paste included
  • Intel Ultra 9 285K processor with 36 MB L3 and 40 MB L2 cache
  • ASUS EX-B860M-V5/SI board with DDR5 memory support and PCIe 4.0 slots
  • Luminous anti-moisture coating plus 8-pin ProCool power connector for durability
  • Shin-Etsu X-23-7868-2D paste rated at 6.2 W/m·k conductivity and 0.07 °C·cm²/W resistance

Built for internet cafes

The ASUS EX-B860M-V5/SI motherboard ships paired with an Intel Ultra 9 285K processor and Shin-Etsu X-23-7868-2D thermal grease. The LGA 1851 socket board uses the B860 chipset in a micro-ATX layout and is validated by ASUS iCafé Lab for continuous gaming and diskless boot environments. DDR5 memory and two PCIe 4.0 x16 slots are supported.

Upgrading from older platforms

Moving to this combo replaces a previous motherboard and CPU with a 3 nm Arrow Lake chip that delivers 36 MB L3 cache and 40 MB L2 cache at a 125 W base power. The jump is worth it when a venue needs certified reboot stability, 2.5 Gbps wired LAN and front USB 5 Gbps Type-C connectivity for modern peripherals. The luminous anti-moisture coating adds durability in humid conditions.

Straightforward assembly

The bundle includes thermal grease rated at 6.2 W/m·k conductivity and 0.07 °C·cm²/W resistance, with a viscosity of 100 Pa·s that makes spreading easy. Apply a thin layer on the integrated heat spreader, seat the processor in the LGA 1851 socket, and secure the cooler. The 8-pin ProCool connector and SafeSlot Core+ graphics slot key clearly, reducing the chance of bent pins or loose power cables.

Najważniejsze cechy

  • Ready-to-build combo with CPU, motherboard and thermal paste included
  • Intel Ultra 9 285K processor with 36 MB L3 and 40 MB L2 cache
  • ASUS EX-B860M-V5/SI board with DDR5 memory support and PCIe 4.0 slots
  • Luminous anti-moisture coating plus 8-pin ProCool power connector for durability
  • Shin-Etsu X-23-7868-2D paste rated at 6.2 W/m·k conductivity and 0.07 °C·cm²/W resistance

Specyfikacja

BrandASUS
ModelEX-B860M-V5/SI+Ultra 9 285K
CPU Socket TypeLGA 1851

Inne wersje tego modelu

Jeszcze 5 w tej samej serii

Ta sama rodzina, inna pamięć, inne chłodzenie lub taktowanie — proszę porównać przed decyzją.

Pytania dotyczące tego produktu

Will the LGA 1851 socket on the EX-B860M-V5/SI fit my existing mATX case?

The board uses the mATX form factor and an LGA 1851 socket, so any chassis that accepts mATX motherboards and has the standard I/O cut-out will accommodate it.

What is the common mistake when applying the included Shin-Etsu X-23-7868-2D thermal grease to the Ultra 9 285K?

Users often spread too thick a layer; the paste has a viscosity of 100 Pa.s and thermal conductivity of 6.2 W/m.k, so a pea-sized dot under the integrated heat spreader is sufficient.

How often should the Shin-Etsu X-23-7868-2D grease be replaced on a 125 W Ultra 9 285K?

The manufacturer suggests a two-year replacement cycle, with an official lifespan of three to five years under typical operating temperatures.

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