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ASUS

ASUS TUF GAMING B860M-PLUS Intel motherboard & Ultra 9 285K CPU combo

SKU CH-HN9Q-FRSE1

A motherboard and CPU combo with a 125 W processor, triple M.2 slots including one PCIe 5.0 x4, DDR5-7600+ support, 2.5 Gb Ethernet, and USB 20 Gbps Type-C

  • CPU Socket TypeLGA 1851

+CPU +Ultra 9 285K

  • Ready-to-build combo with motherboard, Ultra 9 285K CPU and Shin-Etsu thermal paste included
  • 125 W Arrow Lake processor on 3 nm process with 36 MB L3 and 40 MB L2 cache
  • DDR5-7600+(OC) via AEMP III on reinforced SafeDIMM slots
  • Triple M.2 with one PCIe 5.0 x4 at 128 Gbps plus two PCIe 4.0 x4 at 64 Gbps, all heatsinked
  • 5 Gb Ethernet, rear USB 20 Gbps Type-C with DP Alt mode and front USB 10 Gbps Type-C header

ASUS TUF GAMING B860M-PLUS Combo

This bundle pairs the TUF GAMING B860M-PLUS motherboard with an Intel Core Ultra 9 285K processor and Shin-Etsu X-23-7868-2D thermal grease. The board uses an LGA 1851 socket on a micro‑ATX layout. It targets builders who want a ready‑matched CPU and board with included paste for immediate assembly.

Sustained Load Behaviour

The CPU runs at a 125 W base power on a 3 nm TSMC N3B process. The motherboard delivers power through a 12+1+2+1 phase DrMOS design rated at 80 A per phase, fed by dual ProCool 8+8‑pin connectors on an 8‑layer PCB. This VRM arrangement is built to maintain stable current during extended workloads without throttling.

DDR5 Memory Limits

AEMP III firmware enables DDR5 speeds up to 7600 MT/s and beyond when overclocked. Reinforced SafeDIMM slots and DIMM Fit Pro tuning help preserve signal integrity at those frequencies. The practical ceiling will depend on the specific memory kit and cooling, but the board is validated for operation at the rated 7600+ level.

Najważniejsze cechy

  • Ready-to-build combo with motherboard, Ultra 9 285K CPU and Shin-Etsu thermal paste included
  • 125 W Arrow Lake processor on 3 nm process with 36 MB L3 and 40 MB L2 cache
  • DDR5-7600+(OC) via AEMP III on reinforced SafeDIMM slots
  • Triple M.2 with one PCIe 5.0 x4 at 128 Gbps plus two PCIe 4.0 x4 at 64 Gbps, all heatsinked
  • 5 Gb Ethernet, rear USB 20 Gbps Type-C with DP Alt mode and front USB 10 Gbps Type-C header

Specyfikacja

BrandASUS
ModelTUF GAMING B860M-PLUS+Ultra 9 285K
CPU Socket TypeLGA 1851

Inne wersje tego modelu

Jeszcze 5 w tej samej serii

Ta sama rodzina, inna pamięć, inne chłodzenie lub taktowanie — proszę porównać przed decyzją.

Pytania dotyczące tego produktu

How much heat does the Ultra 9 285K CPU generate under sustained load?

The Ultra 9 285K has a 125W base power rating. The included Shin-Etsu X-23-7868-2D thermal grease offers 6.2 W/m.k conductivity and 0.07 °C*cm^2/W resistance for efficient heat transfer.

What cooler mounting hardware is required for the LGA 1851 socket on this board?

The motherboard uses the LGA 1851 socket. You must provide a CPU cooler with the correct LGA 1851 mounting kit; the bundle only includes the processor and thermal grease.

Will my existing DDR5 memory run at its rated speed with the AEMP III feature?

The board supports DDR5-7600+(OC) via AEMP III technology and includes reinforced SafeDIMM slots with DIMM Fit Pro tuning for optimised memory stability.

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