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ASUS TUF B860M-PLUS mATX motherboard with Intel Ultra 5 245K CPU and Shin-Etsu thermal paste tube

ASUS

ASUS TUF GAMING B860M-PLUS + Intel Ultra 5 245K Intel motherboard combo

SKU CH-GWTD-QZ5ZK

LGA 1851 mATX motherboard paired with a 125 W 3 nm Intel Ultra 5 245K CPU, 12+1+2+1 80 A DrMOS VRM, DDR5-7600 AEMP III support, triple M.2 with PCIe 5.0 and 4.0 heatsinks, 2.5 Gb Ethernet.

  • CPU Socket TypeLGA 1851

model TUF GAMING B860M-PLUS

Pokaż jeszcze 3 konfiguracji

+CPU +Ultra 5 245K

  • Ready-to-build bundle with motherboard, CPU and Shin-Etsu X-23-7868-2D thermal paste
  • 125W Intel Ultra 5 245K on 3nm process with 24MB L3 and 26MB L2 cache
  • 12+1+2+1 phase 80A DrMOS VRM on 8-layer PCB with ProCool 8+8-pin power
  • DDR5-7600+(OC) via AEMP III on reinforced SafeDIMM slots with DIMM Fit Pro
  • PCIe 5.0 x4 M.2 at 128Gbps plus dual PCIe 4.0 x4 M.2 at 64Gbps, all heatsinked

Combo contents

This bundle pairs the ASUS TUF GAMING B860M-PLUS motherboard with the Intel Ultra 5 245K processor and Shin-Etsu X-23-7868-2D thermal grease. The LGA 1851 socket board uses an 80A DrMOS VRM across 12+1+2+1 phases fed by dual 8-pin ProCool connectors on an 8-layer PCB. It targets builders who want a ready-to-install platform for Core Ultra Series 2 processors.

Memory and storage capacity

Four DDR5 slots support AEMP III profiles up to DDR5-7600+(OC) with SafeDIMM reinforcement and DIMM Fit Pro tuning. Storage uses three M.2 slots: one PCIe 5.0 x4 at 128Gbps and two PCIe 4.0 x4 at 64Gbps, each with a dedicated heatsink. The CPU brings 24MB L3 cache and 26MB L2 cache for high-throughput workloads.

Interface practical limits

Rear I/O includes a USB 20Gbps Type-C port with DisplayPort Alt Mode and a 2.5Gb Ethernet jack protected by TUF LANGuard. A front-panel USB 10Gbps Type-C header is also provided. The CPU operates at a 125W base power on TSMC N3B 3nm silicon with integrated Intel Graphics. The included grease rates 6.2 W/m·K conductivity and 0.07 °C·cm²/W resistance with a suggested two-year replacement cycle.

Najważniejsze cechy

  • Ready-to-build bundle with motherboard, CPU and Shin-Etsu X-23-7868-2D thermal paste
  • 125W Intel Ultra 5 245K on 3nm process with 24MB L3 and 26MB L2 cache
  • 12+1+2+1 phase 80A DrMOS VRM on 8-layer PCB with ProCool 8+8-pin power
  • DDR5-7600+(OC) via AEMP III on reinforced SafeDIMM slots with DIMM Fit Pro
  • PCIe 5.0 x4 M.2 at 128Gbps plus dual PCIe 4.0 x4 M.2 at 64Gbps, all heatsinked

Specyfikacja

BrandASUS
ModelTUF GAMING B860M-PLUS+Ultra 5 245K
CPU Socket TypeLGA 1851

Inne wersje tego modelu

Jeszcze 5 w tej samej serii

Ta sama rodzina, inna pamięć, inne chłodzenie lub taktowanie — proszę porównać przed decyzją.

Pytania dotyczące tego produktu

Will my existing DDR5 memory run at its rated speed on the B860M-PLUS motherboard?

The board uses AEMP III technology to optimise DDR5-7600+(OC) speeds on compatible kits, and the reinforced SafeDIMM slots with DIMM Fit Pro tuning help maintain stability with your current modules.

How can I verify the Intel Ultra 5 245K and motherboard are functioning correctly after assembly?

Enter the UEFI BIOS to confirm the CPU is detected at its 3 nm Arrow Lake architecture with 24 MB L3 and 26 MB L2 cache, check that all three M.2 slots report PCIe 5.0 x4 and dual PCIe 4.0 x4 links, and ensure the 2.5 Gb Ethernet and rear USB 20 Gbps Type-C with DP Alt Mode are active.

Does the combo include a CPU cooler or do I need to buy one separately?

The package supplies the motherboard, the Intel Ultra 5 245K processor and a tube of Shin-Etsu X-23-7868-2D thermal grease (6.2 W/m·k conductivity, 0.07 °C·cm²/W resistance, grey, 100 Pa·s viscosity), but no cooling device is included, so a compatible LGA 1851 cooler must be purchased separately.

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