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ASUS

ASUS B860M AYW GAMING WIFI + Intel Ultra 5 245K Intel motherboard combo

SKU CH-XAZP-EXSH2

A micro-ATX motherboard and Intel Ultra 5 245K CPU combo with DDR5 support, PCIe 5.0 M.2 slots, WiFi 6, 2.5Gb LAN and pre-applied thermal grease

  • CPU Socket TypeLGA 1851

+CPU +Ultra 5 245K

  • Ready-to-build bundle with motherboard, CPU and Shin-Etsu X-23-7868-2D thermal paste included
  • 12-core 3 nm processor with 24 MB L3 and 26 MB L2 cache for responsive multitasking
  • DDR5 memory tuned by AEMP 3.0 reaching 7600 MT/s speeds with DIMM FIT stability
  • Dual M.2 slots including one PCIe 5.0 x4 and one PCIe 4.0 x4 delivering up to 128 Gbps throughput
  • WiFi 6 plus 2.5 Gb LAN with rear USB 10 Gbps Type-A and front USB 5 Gbps Type-C header

Combo contents

This bundle pairs the ASUS B860M AYW GAMING WIFI motherboard with an Intel Ultra 5 245K processor and a tube of Shin-Etsu X-23-7868-2D thermal grease. The board uses an LGA 1851 socket and the micro-ATX form factor. It is aimed at builders who want a ready-matched CPU and platform in one purchase.

Who this suits

DIY builders who prefer a pre-validated CPU and motherboard combination with WiFi 6 and 2.5 Gb LAN included. The 125 W processor and DDR5 optimisation suit gaming and productivity workloads. Buyers needing a larger ATX board, a different socket, or a bundled cooler should look at other options.

Installation notes

The pre-mounted I/O shield and PCIe Slot Q-Release simplify assembly. Apply the supplied gray paste, which has a 6.2 W/m.k conductivity and 0.07 °C*cm²/W resistance, using the pea method. The 100 Pa.s viscosity spreads easily. Remember the CPU ships without a cooler, so source one rated for 125 W before starting.

Najważniejsze cechy

  • Ready-to-build bundle with motherboard, CPU and Shin-Etsu X-23-7868-2D thermal paste included
  • 12-core 3 nm processor with 24 MB L3 and 26 MB L2 cache for responsive multitasking
  • DDR5 memory tuned by AEMP 3.0 reaching 7600 MT/s speeds with DIMM FIT stability
  • Dual M.2 slots including one PCIe 5.0 x4 and one PCIe 4.0 x4 delivering up to 128 Gbps throughput
  • WiFi 6 plus 2.5 Gb LAN with rear USB 10 Gbps Type-A and front USB 5 Gbps Type-C header

Specyfikacja

BrandASUS
ModelB860M AYW GAMING WIFI+Ultra 5 245K
CPU Socket TypeLGA 1851

Inne wersje tego modelu

Jeszcze 5 w tej samej serii

Ta sama rodzina, inna pamięć, inne chłodzenie lub taktowanie — proszę porównać przed decyzją.

Pytania dotyczące tego produktu

What memory do I need installed before the Intel Ultra 5 245K will post on this B860M board?

The board requires DDR5 modules; AEMP 3.0 can push supported kits to DDR5-7600+ speeds and DIMM FIT helps keep them stable.

Will my existing PCIe 4.0 M.2 drive run at full speed in the second slot?

Yes, the second M.2 slot is wired for PCIe 4.0 x4 so a 4.0 drive keeps its native bandwidth while the top slot runs at 5.0 x4.

How can I confirm the Shin-Etsu X-23-7868-2D paste was applied correctly after mounting the cooler?

With 6.2 W/m·k conductivity and 0.07 °C·cm²/W resistance, idle core temperatures should sit close to ambient and load temps should stay well under the 125 W TDP limit.

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