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ASUS PRIME B860M-K mATX motherboard, Intel Ultra 5 245K CPU, Shin-Etsu X-23-7868-2D thermal grease tube

ASUS

ASUS PRIME B860M-K Intel motherboard & Ultra 5 245K CPU combo with Shin-Etsu X-23-7868-2D thermal grease

SKU CH-F90X-0SZDC

Bundles a B860 micro-ATX board with an Intel Ultra 5 245K processor and Shin-Etsu X-23-7868-2D thermal compound

  • CPU Socket TypeLGA 1851

model PRIME B860M-K

Pokaż jeszcze 3 konfiguracji

+CPU +Ultra 5 245K

  • Ready-to-build bundle includes motherboard, CPU and thermal grease
  • 14-core Intel Ultra 5 245K delivers 125W base power for demanding tasks
  • Dual M.2 slots with PCIe 5.0 x4 and 4.0 x4 for fast storage
  • 5Gb Ethernet plus front USB 5Gbps Type-C and rear USB 10Gbps Type-A
  • Shin-Etsu X-23-7868-2D grease rated 6.2 W/m·K for efficient heat transfer

Combo contents

This bundle pairs an ASUS PRIME B860M-K motherboard with an Intel Ultra 5 245K processor and a tube of Shin-Etsu X-23-7868-2D thermal grease. The board uses the LGA 1851 socket and is built around the Intel B860 chipset in a micro-ATX layout. The CPU is a 125 W Arrow Lake part manufactured on TSMC N3B with 24 MB L3 and 26 MB L2 cache. The included grease has a thermal conductivity of 6.2 W/m·k and a suggested replacement cycle of two years.

Upgrade context

The combination replaces a system based on an older LGA 1700 platform running 12th- to 14th-generation Intel Core or Core Ultra Series 2 processors. Moving to LGA 1851 brings the newer Arrow Lake architecture and the DDR5-7600+ memory optimisation offered by ASUS Enhanced Memory Profile III. The jump is worthwhile when the workload benefits from the updated core design, higher memory speeds and the dual M.2 arrangement with one PCIe 5.0 x4 slot at 128 Gbps and one PCIe 4.0 x4 slot at 64 Gbps.

Interface limits

The board provides a PCIe 5.0 x16 SafeSlot Core+ for graphics and the two M.2 slots described above. Rear I/O includes a USB 10 Gbps Type-A port and a 2.5 Gb Ethernet jack, while a front-panel USB 5 Gbps Type-C header is available internally. Storage connects through SATA 6 Gbps ports. Memory support tops out at DDR5-7600+(OC) via AEMP III. The thermal grease viscosity is rated at 100 Pa·s with a thermal resistance of 0.07 °C·cm²/W, and the paste is grey in colour.

Najważniejsze cechy

  • Ready-to-build bundle includes motherboard, CPU and thermal grease
  • 14-core Intel Ultra 5 245K delivers 125W base power for demanding tasks
  • Dual M.2 slots with PCIe 5.0 x4 and 4.0 x4 for fast storage
  • 5Gb Ethernet plus front USB 5Gbps Type-C and rear USB 10Gbps Type-A
  • Shin-Etsu X-23-7868-2D grease rated 6.2 W/m·K for efficient heat transfer

Specyfikacja

BrandASUS
ModelPRIME B860M-K+Ultra 5 245K
CPU Socket TypeLGA 1851

Inne wersje tego modelu

Jeszcze 5 w tej samej serii

Ta sama rodzina, inna pamięć, inne chłodzenie lub taktowanie — proszę porównać przed decyzją.

Pytania dotyczące tego produktu

What socket and cooler clearance does the PRIME B860M-K need for the Ultra 5 245K?

The board uses the LGA 1851 socket and the CPU is a 125W part sold without a cooler, so you must supply a compatible LGA 1851 cooler that fits your case height limit.

Which step do builders often miss when applying the Shin-Etsu X-23-7868-2D paste?

Clean both the CPU heat-spreader and cooler base with isopropyl alcohol, then apply a pea-sized dot of the grey 6.2 W/m.k paste — do not spread it manually; mounting pressure will spread it evenly.

When should the Shin-Etsu X-23-7868-2D thermal grease be replaced?

The manufacturer suggests a 2-year replacement cycle; the official lifespan is 3 to 5 years, so plan to re-paste within that window if temperatures rise.

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