ASUS PRIME B860M-K Intel motherboard & Ultra 5 245K CPU combo with Shin-Etsu X-23-7868-2D thermal grease
- LGA 1851
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ASUS
A motherboard and CPU combo with a 125 W processor, triple M.2 slots including one PCIe 5.0 x4, DDR5-7600+ support, 2.5 Gb Ethernet, and USB 20 Gbps Type-C
model TUF GAMING B860M-PLUS
+CPU +Ultra 9 285K
This bundle pairs the TUF GAMING B860M-PLUS motherboard with an Intel Core Ultra 9 285K processor and Shin-Etsu X-23-7868-2D thermal grease. The board uses an LGA 1851 socket on a micro‑ATX layout. It targets builders who want a ready‑matched CPU and board with included paste for immediate assembly.
The CPU runs at a 125 W base power on a 3 nm TSMC N3B process. The motherboard delivers power through a 12+1+2+1 phase DrMOS design rated at 80 A per phase, fed by dual ProCool 8+8‑pin connectors on an 8‑layer PCB. This VRM arrangement is built to maintain stable current during extended workloads without throttling.
AEMP III firmware enables DDR5 speeds up to 7600 MT/s and beyond when overclocked. Reinforced SafeDIMM slots and DIMM Fit Pro tuning help preserve signal integrity at those frequencies. The practical ceiling will depend on the specific memory kit and cooling, but the board is validated for operation at the rated 7600+ level.
| Brand | ASUS |
|---|---|
| Model | TUF GAMING B860M-PLUS+Ultra 9 285K |
| CPU Socket Type | LGA 1851 |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
The Ultra 9 285K has a 125W base power rating. The included Shin-Etsu X-23-7868-2D thermal grease offers 6.2 W/m.k conductivity and 0.07 °C*cm^2/W resistance for efficient heat transfer.
The motherboard uses the LGA 1851 socket. You must provide a CPU cooler with the correct LGA 1851 mounting kit; the bundle only includes the processor and thermal grease.
The board supports DDR5-7600+(OC) via AEMP III technology and includes reinforced SafeDIMM slots with DIMM Fit Pro tuning for optimised memory stability.
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