ASUS PRIME B860M-K Intel motherboard & Ultra 5 245K CPU combo with Shin-Etsu X-23-7868-2D thermal grease
- LGA 1851
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ASUS
A bundle pairing an Intel Ultra 5 245K processor with an LGA 1851 mATX board that supports DDR5-7600, PCIe 5.0 x16 graphics, dual M.2 slots, a rear 20Gbps USB-C port and 2.5Gb Ethernet.
model PRIME B860M-A
+CPU +Ultra 5 245K
This bundle pairs an ASUS PRIME B860M-A motherboard with an Intel Ultra 5 245K processor and a tube of Shin-Etsu X-23-7868-2D thermal grease. The motherboard uses the Intel B860 chipset and an LGA 1851 socket. The CPU is a 125W Arrow Lake part with 24MB L3 and 26MB L2 cache. Integrated Intel Graphics are included on the processor.
Verify that your chassis accepts a micro-ATX board and that your power supply provides an 8-pin EPS connector for the 10-phase 80A DrMOS VRM. Memory must be DDR5; the board supports AEMP 3.0 for DDR5-7600+ operation. The CPU cooler mounting pattern must match LGA 1851. Rear I/O includes a 20Gbps USB-C port and 2.5Gb Ethernet.
The supplied Shin-Etsu grease has a thermal conductivity of 6.2 W/m.k and a thermal resistance of 0.07 °C·cm²/W. Its viscosity is rated at 100 Pa·s and the grey paste is described as easy to apply. The manufacturer suggests a replacement cycle of two years against an official lifespan of three to five years. No cooling device is included with the processor.
| Brand | ASUS |
|---|---|
| Model | PRIME B860M-A+Ultra 5 245K |
| CPU Socket Type | LGA 1851 |
| Chipset | Intel B860 |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
The box contains the PRIME B860M-A motherboard, the Intel Ultra 5 245K processor, and a tube of Shin-Etsu X-23-7868-2D thermal grease. A CPU cooler is not included and must be purchased separately.
The first slot runs at PCIe 5.0 x4 with 128Gbps bandwidth, while the second runs at PCIe 4.0 x4. Install your primary OS drive in the faster 5.0 slot for maximum throughput.
The 125W rating indicates the sustained heat the cooler must dissipate. Pair it with a quality air or liquid cooler rated for at least that TDP and use the included Shin-Etsu paste (6.2 W/m·k conductivity) for optimal thermal transfer.
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