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Silver aluminium fin heatsink with heat pipes, 2U passive cooler, 126.8 x 97.8 x 64.0 mm

Dynatron

Dynatron C1 2U passive CPU cooler LGA 7529 126.8 x 97.8 x 64.0 mm

SKU CH-PS7E-BEM3R MPN C1

Passive 2U heatsink for Intel LGA 7529 sockets, aluminium fins with heat pipes, 650 g, includes Shin-Etsu X23-8079-2 thermal grease

  • ColorSilver
  • TypeHeatsinks only
  • Heatsink MaterialAluminum Fin with Heat Pipe
  • Heatsink Dimensions126.8 x 97.8 x 64.0 mm
  • Weight650 g
  • Package ContentsThermal Grease: Shin-Etsu X23-8079-2 Pre-Printed
  • Passive cooling eliminates fan noise for silent 2U server operation
  • Aluminium fins with heat pipe transfer heat efficiently from Intel Granite Rapid AP CPUs
  • Compact 126.8 x 97.8 x 64.0 mm footprint fits dense rack builds
  • Pre-applied Shin-Etsu X23-8079-2 thermal grease ensures optimal contact out of the box
  • Secured with #8-32 screws at 8 in-lb torque for reliable mounting on LGA 7529 sockets

LGA 7529 2U passive cooler

The Dynatron C1 is a passive heatsink designed for Intel Granite Rapid AP processors in the LGA 7529 socket. It fits 2U server chassis and taller enclosures, using aluminium fins and heat pipes to dissipate thermal load without a fan. Shin-Etsu X23-8079-2 pre-printed thermal grease is included in the package. The unit weighs 650 g and measures 126.8 x 97.8 x 64.0 mm.

Server builders without case airflow

This cooler suits integrators building 2U or higher servers where chassis fans provide the necessary airflow across the heatsink. It is not intended for systems that rely on an attached fan for CPU cooling, nor for workstations or desktops that lack directed airflow over the fin stack. Builders needing active cooling or a different socket mounting pattern should consider other solutions.

126.8 x 97.8 x 64.0 mm footprint

The cooler’s physical dimensions of 126.8 x 97.8 x 64.0 mm determine whether it clears surrounding components and fits the allocated space in a 2U chassis. Verify the exact keep-out zone around the LGA 7529 socket before purchase. The #8-32 mounting screws require an installation torque of 8 in-lb for secure attachment.

Najważniejsze cechy

  • Passive cooling eliminates fan noise for silent 2U server operation
  • Aluminium fins with heat pipe transfer heat efficiently from Intel Granite Rapid AP CPUs
  • Compact 126.8 x 97.8 x 64.0 mm footprint fits dense rack builds
  • Pre-applied Shin-Etsu X23-8079-2 thermal grease ensures optimal contact out of the box
  • Secured with #8-32 screws at 8 in-lb torque for reliable mounting on LGA 7529 sockets

Specyfikacja

BrandDynatron
ModelC1
ColorSilver
TypeHeatsinks only
Heatsink MaterialAluminum Fin with Heat Pipe
Heatsink Dimensions126.8 x 97.8 x 64.0 mm
Weight650 g
Package ContentsThermal Grease: Shin-Etsu X23-8079-2 Pre-Printed
Waga przesyłki0.79 kg
Wymiary opakowania152 × 127 × 102 mm

Pytania dotyczące tego produktu

Does the C1 include thermal paste or must I buy it separately?

The package includes Shin-Etsu X23-8079-2 pre-printed thermal grease, so no separate purchase is required.

Which socket version does the C1 fit?

It is designed for the Intel LGA 7529 socket used by Granite Rapid AP processors.

Will the 64 mm height fit in a standard 2U rack chassis?

Yes, the cooler is rated for 2U server and up, and its 64.0 mm height matches the 2U form factor.

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