Thermalright MC-2 ARGB Memory Cooler White 3200 RPM
- Fan & Heatsinks
- DDR/DDR2/DDR3/DDR4/…
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Dynatron
Passive 2U heatsink for Intel LGA 7529 sockets, aluminium fins with heat pipes, 650 g, includes Shin-Etsu X23-8079-2 thermal grease
The Dynatron C1 is a passive heatsink designed for Intel Granite Rapid AP processors in the LGA 7529 socket. It fits 2U server chassis and taller enclosures, using aluminium fins and heat pipes to dissipate thermal load without a fan. Shin-Etsu X23-8079-2 pre-printed thermal grease is included in the package. The unit weighs 650 g and measures 126.8 x 97.8 x 64.0 mm.
This cooler suits integrators building 2U or higher servers where chassis fans provide the necessary airflow across the heatsink. It is not intended for systems that rely on an attached fan for CPU cooling, nor for workstations or desktops that lack directed airflow over the fin stack. Builders needing active cooling or a different socket mounting pattern should consider other solutions.
The cooler’s physical dimensions of 126.8 x 97.8 x 64.0 mm determine whether it clears surrounding components and fits the allocated space in a 2U chassis. Verify the exact keep-out zone around the LGA 7529 socket before purchase. The #8-32 mounting screws require an installation torque of 8 in-lb for secure attachment.
| Brand | Dynatron |
|---|---|
| Model | C1 |
| Color | Silver |
| Type | Heatsinks only |
| Heatsink Material | Aluminum Fin with Heat Pipe |
| Heatsink Dimensions | 126.8 x 97.8 x 64.0 mm |
| Weight | 650 g |
| Package Contents | Thermal Grease: Shin-Etsu X23-8079-2 Pre-Printed |
| Shipping weight | 0.79 kg |
| Package size | 152 × 127 × 102 mm |
The package includes Shin-Etsu X23-8079-2 pre-printed thermal grease, so no separate purchase is required.
It is designed for the Intel LGA 7529 socket used by Granite Rapid AP processors.
Yes, the cooler is rated for 2U server and up, and its 64.0 mm height matches the 2U form factor.
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