BFKK
BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
214,99 USD
0.00275801BTC
Dostępny
G.SKILL
G.SKILL F3-2133C11D-16GAR 16GB (2x8GB) DDR3 2133 CL11 desktop RAM
Dual-channel DDR3 kit delivering 16 GB at 2133 MT/s with CL11 11-13-13-31 timings and 1.50 V XMP profiles for LGA1150 and LGA1155 platforms
- Capacity16GB (2 x 8GB)
- SpeedDDR3 2133 (PC3 17000)
- CAS LatencyCL11
- Timing11-13-13-31
- Voltage1.50V
- ECCNo
- 16 GB dual-channel kit readies systems for heavy multitasking
- DDR3 2133 MHz CL11 timing accelerates data throughput
- 50 V operation keeps power draw predictable
- 2 cm low-profile heat spreader clears large CPU coolers
- Intel XMP support simplifies one-click overclocking on LGA1155 and LGA1150 platforms
G.SKILL Ares 16 GB DDR3 2133 Kit
The G.SKILL Ares Series F3-2133C11D-16GAR is a 16 GB dual-channel kit built from two 8 GB unbuffered DDR3 modules. Rated at 2133 MHz with timings of 11-13-13-31 and a CAS latency of 11, the kit runs at 1.50 V and includes Intel XMP profiles for second, third and fourth generation Core processors on LGA1155 and LGA1150 platforms. A low-profile red heat spreader stands 3.2 cm tall and carries green LEDs.
Who this suits and who should look elsewhere
Builders upgrading or repairing LGA1155 or LGA1150 systems that support DDR3 2133 will find the rated speed and XMP support straightforward to enable. The low-profile height clears large CPU coolers and fits small-form-factor cases. Systems requiring ECC, registered modules, or a different DDR generation should select a different kit.
Deciding specification — DDR3 2133 at 1.50 V
The single specification that decides fitment is the DDR3 2133 rating at 1.50 V. Only motherboards and CPUs that officially support DDR3 at this voltage and data rate can run the kit at its rated 17.0 GB/s per channel without manual timing adjustments.
Najważniejsze cechy
- 16 GB dual-channel kit readies systems for heavy multitasking
- DDR3 2133 MHz CL11 timing accelerates data throughput
- 50 V operation keeps power draw predictable
- 2 cm low-profile heat spreader clears large CPU coolers
- Intel XMP support simplifies one-click overclocking on LGA1155 and LGA1150 platforms
Specyfikacja
| Brand | G.SKILL |
|---|---|
| Series | Ares Series |
| Model | F3-2133C11D-16GAR |
| Capacity | 16GB (2 x 8GB) |
| Speed | DDR3 2133 (PC3 17000) |
| CAS Latency | CL11 |
| Timing | 11-13-13-31 |
| Voltage | 1.50V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Multi-channel Kit | Dual Channel Kit |
| Color | Red |
| Heat Spreader | Yes |
| Features | Compatible with Intel LGA1155 and LGA1150 platforms Intel XMP support for 2nd,3rd and 4th Generation Intel Core Processors To reach rated memory speed, enabling Intel XMP profile or manual BIOS tuning is required Combination with other memory kits or modules (even with same model number) is not recommended to avoid any compatibility issues |
| LED Color | Green |
| Waga przesyłki | 0.11 kg |
| Wymiary opakowania | 204 × 138 × 17 mm |
Pytania dotyczące tego produktu
Will the 3.2 cm Ares heat spreader clear my oversized CPU cooler?
The low-profile spreader is only 3.2 cm tall, leaving ample clearance for most large air coolers and small-form-factor cases.
Can I mix these CL11 2133 MHz modules with slower DDR3 sticks I already own?
The motherboard will run all populated slots at the speed and timings of the slowest installed kit, so your existing modules will dictate the final frequency.
How do I confirm the kit is running at its rated 2133 MHz 11-13-13-31 timings?
Enable the Intel XMP profile in BIOS, then verify the active frequency and timings with CPU-Z or the motherboard’s built-in memory-info screen.
Także w tym dziale
Klienci porównywali też te produkty
Ten sam dział, ta sama kasa — osiem kryptowalut i 30-minutowa blokada kursu.
BFKK
BFKK 2U Micro ATX Rackmount 2×5.25" 4×3.5" Side 80mm Fan
- Rackmount
216,99 USD
0.00278367BTC
Dostępny
