coxbyte
coxbyte TG-30 thermal paste 17.5W/mK 20g
High-conductivity 17.5 W/mK paste in a 20 g can for CPU, GPU and LED cooling from -50 °C to 250 °C
- Volume / Net Weight20g
- Thermal Conductivity17.5 W/mK
- Long Term Operating Temperature-50 to 250 C
- SpecificationsTG-30 adopts an improved nanocarbon tube composite formula w
- High 17.5 W/mK conductivity cuts CPU/GPU temperatures fast
- Non-conductive formula removes short-circuit risk during application
- Stable from -50 °C to 250 °C without evaporating
- Less than 3 % performance loss over five years
- Smooth silicone gel spreads evenly in thin layer
Premium thermal compound for high-heat components
Coxbyte TG-30 thermal paste delivers 17.5 W/mK conductivity in a 20 g can. The non-conductive silicone formula suits CPUs, GPUs, gaming laptops and LED modules. It operates from -50 °C to 250 °C without evaporating. Designed for enthusiasts who need reliable heat transfer under sustained loads.
Replaces standard pastes when temperatures stay high
Upgrading is worthwhile if stock or basic compound leaves cores running hot during gaming or rendering. The nanocarbon composite cuts the core-to-cooler delta by more than 20 °C in typical use. Degradation stays below 3 % over five years, so re-application intervals are longer. Not for builders who only need a basic paste for light office workloads.
Verify cooler mounting pressure
Ensure the heatsink makes even contact; uneven pressure traps air bubbles regardless of paste quality. Clean old compound fully with isopropyl alcohol before applying the centre-dot method. The target layer thickness matches a sheet of A4 paper. No electrical conductivity risk, but avoid excess squeeze-out near socket pins.
Besonderheiten
- High 17.5 W/mK conductivity cuts CPU/GPU temperatures fast
- Non-conductive formula removes short-circuit risk during application
- Stable from -50 °C to 250 °C without evaporating
- Less than 3 % performance loss over five years
- Smooth silicone gel spreads evenly in thin layer
Technische Daten
| Brand | coxbyte |
|---|---|
| Series | TG |
| Model | 30 |
| Volume / Net Weight | 20g |
| Thermal Conductivity | 17.5 W/mK |
| Long Term Operating Temperature | -50 to 250 C |
| Specifications | TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit, with good viscosity optimization. Single point or nine point coating can be extended to a uniform thermal conductive layer with a thickness of 0.15mm, improving operational convenience by 15%. After curing, the tempe |
Fragen zu diesem Artikel
What size surface area does the 20g can cover?
The 20g canned paste is sufficient for multiple CPU or GPU applications; apply a layer roughly the thickness of an A4 sheet on each die.
How do I apply the TG-30 paste correctly?
Clean the die, place a dot of paste at the centre, then spread it evenly with a scraper until the layer matches the thickness of an A4 paper.
How long before the thermal performance degrades?
Performance loss stays under 3 % over five years; the compound remains stable from -50 °C to 250 °C without evaporating.
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