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Square grey thermal pad, 120 by 120 by 2.0 mm, soft flexible sheet

Lirealar

Lirealar 120x120mm thermal pad 12.8 W/mK 2.0mm 15g

SKU CH-SXGA-N8AY9 MPN 120x120mm

A 120 × 120 mm, 2.0 mm thick silicone thermal pad rated at 12.8 W/mK that fills gaps between CPUs, GPUs or LED coolers and heatsinks while remaining electrically non-conductive and reusable

  • Volume / Net Weight15g
  • Thermal Conductivity12.8 W/mK,
  • Long Term Operating Temperature-40 C to +400C
  • SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/c
  • FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi

Type Thermal Pad

Model 120x120mm

Durchgestrichene Varianten existieren, sind hier aber nicht vorrätig.

Specification 2.0mm

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  • High 12.8 W/mK conductivity moves heat fast from CPU or GPU
  • 0 mm thickness fills uneven gaps between chip and heatsink
  • Non-conductive insulation prevents short circuits on dense circuit boards
  • Operates from -40 °C to 200 °C for long-term stability in laptops and desktops
  • Soft 30-55 Shore C hardness compresses easily and can be reused during maintenance

Gap-filling thermal pad for CPUs GPUs

This 120x120mm silicone pad sits between a heat source and a heatsink to eliminate air gaps that impede heat flow. Its 12.8 W/mK conductivity suits desktop and laptop processors graphics cards and LED modules. The material is non-conductive non-corrosive and non-toxic.

Peel-and-place installation with natural viscosity

The pad ships as a single 2.0mm thick sheet weighing 15g that can be cut to shape if needed. Natural tack holds it in place during assembly and allows repositioning or reuse. Non-curing compound means no mess and no drying time.

Verify gap thickness and surface flatness before

Measure the distance between your component and heatsink to confirm a 2.0mm pad will compress correctly without excessive force. Ensure mounting pressure can achieve the 30-55 Shore C hardness range for optimal contact. Check that operating temperatures stay within the -40C to 200C continuous range.

Besonderheiten

  • High 12.8 W/mK conductivity moves heat fast from CPU or GPU
  • 0 mm thickness fills uneven gaps between chip and heatsink
  • Non-conductive insulation prevents short circuits on dense circuit boards
  • Operates from -40 °C to 200 °C for long-term stability in laptops and desktops
  • Soft 30-55 Shore C hardness compresses easily and can be reused during maintenance

Technische Daten

SeriesThermal Pad
Model120x120x2.0mm
Volume / Net Weight15g
Thermal Conductivity12.8 W/mK,
Long Term Operating Temperature-40 C to +400C
SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C
FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable

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Fragen zu diesem Artikel

How can I verify the Lirealar thermal pad is performing correctly after installation?

Check that component temperatures drop under load and the pad remains intact without curing or shifting, confirming its 12.8 W/mK conductivity is bridging the gap effectively.

What exactly is included with the 120x120mm pad and do I need any extra materials?

The package contains one 15 g gray silicone pad measuring 120 x 120 x 2.0 mm; no additional compounds or adhesives are required for installation.

Which thickness and size variant should I select for my GPU or CPU heatsink gap?

Choose the 2.0 mm thick 120 x 120 mm version when your heat-sink gap matches those dimensions; it covers a 120 mm square area and compresses to fill uneven surfaces.

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