BFKK
BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
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YINGHUA
YINGHUA 128MB Motherboard V2.9 USB Hub V2.1 DIY Metal Case Kit Black
A 128 MB FPGA expansion kit with USB 2.1 hub, IO board and metal case for Terasic DE10-Nano Mister systems
- CPU TypeIntel Atom
- 128MB SDRAM enables large MiSTer cores
- V2.9 motherboard revision for DE10-Nano compatibility
- USB Hub V2.1 adds upstream micro-USB and 5V DC power
- DIY metal case kit provides sturdy black enclosure
- IO board adds VGA, 3.5mm audio, buttons, LEDs and fan header
Kit Contents
This kit bundles a Mister FPGA 128MB Motherboard V2.9, a USB Hub V2.1 based on the FE 2.1 chip, and a DIY metal case. It is designed for builders assembling a MiSTer system around a Terasic DE10-Nano board.
Expansion Features
The IO board adds VGA output, a 3.5 mm audio jack with TOSLink, three buttons, three status LEDs, a secondary SD card slot, a cooling fan, and an expansion connector using a USB 3.0 form factor. The USB hub provides extra ports and an upstream micro-USB connection with 5V DC input.
Target Platform
This hardware is made exclusively for the Terasic DE10-Nano SoC and the MiSTer FPGA platform. It will not function as a general-purpose server motherboard or fit other development boards.
Besonderheiten
- 128MB SDRAM enables large MiSTer cores
- V2.9 motherboard revision for DE10-Nano compatibility
- USB Hub V2.1 adds upstream micro-USB and 5V DC power
- DIY metal case kit provides sturdy black enclosure
- IO board adds VGA, 3.5mm audio, buttons, LEDs and fan header
Technische Daten
| CPU Type | Intel Atom |
|---|
Fragen zu diesem Artikel
How do I install the USB Hub V2.1 board without extra wires?
The upstream micro-USB port on the hub bridges directly to the DE10-Nano SoC board, so no additional cables are required for the connection.
What maintenance will the IO board fan need over time?
The fan cools the FPGA and should be cleaned periodically to prevent dust build-up that reduces airflow and cooling efficiency.
What is the first limit I will hit during sustained FPGA workloads?
Thermal limits on the FPGA appear first; the included fan on the IO board is intended to keep temperatures in check during extended use.
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