Aceptamos criptomonedas — así, las criptos que usted tiene pueden comprar hardware real.Pague en cripto y gástela en hardware real. Envío asegurado gratis a nivel mundial a partir de $399. Cajas neutras, sin marca, enviadas desde Alemania.Envío asegurado gratis a partir de $399. Su cotización queda bloqueada 30 minutos en cuanto se abre el pago.Cotización bloqueada 30 minutos. Todos los artículos vienen sellados, con el número de serie verificado y cubiertos por una garantía de 24 meses.Sellado, con 24 meses de garantía.

Artículos guardados Iniciar sesión
White Micro-ATX motherboard with silver heatsinks and rear I/O shield

GIGABYTE

GIGABYTE B850M A ELT WF6E ICE AMD motherboard

SKU CH-W5RN-HY3NN MPN B850M A ELT WF6E ICE

Micro ATX AM5 board with DDR5 up to 8200, PCIe 5.0, two M.2 slots, WIFI6E, 2.5GbE LAN and DIY-friendly EZ-Latch

  • CPU Socket TypeAM5
  • CPU TypeRyzen 7000 Series / Ryzen 8000 Series / Ryzen 9000 Series
  • ChipsetAMD B850
  • Number of Memory Slots4x288pin (DDR5)
  • Memory StandardUp to DDR5 8200(O.C)
  • Maximum Memory Supported256GB

Option B850M A ELT WF6E ICE

Las versiones tachadas existen, pero no están disponibles aquí.

  • Supports Ryzen 7000, 8000 and 9000 series processors with AM5 socket
  • DDR5 memory up to 8200 MT/s across four slots for 256 GB total capacity
  • PCIe 5.0 x16 slot plus two M.2 connectors for high-speed expansion
  • WIFI6E and 2.5 GbE LAN with Bluetooth for fast wireless and wired networking
  • EZ-Latch mechanisms on M.2 and PCIe slots simplify component installation

AM5 Socket For Ryzen 7000 8000 9000

This micro ATX motherboard uses the AMD B850 chipset and an AM5 socket. It accepts Ryzen 7000, 8000 and 9000 series processors. Four 288-pin DDR5 slots support up to 256 GB of memory at speeds reaching DDR5 8200 when overclocked. A 12+2+2 phase power design feeds the CPU.

VRM And M.2 Thermal Guard

The board includes a VRM thermal guard and an M.2 thermal guard to manage heat during normal operation. A single PCI Express 5.0 x16 slot and two M.2 slots provide high-speed expansion. Networking uses 2.5 Gbps LAN and Wi-Fi 802.11 ax with Bluetooth. Rear I/O supplies DisplayPort, USB 3.2 Gen 2 Type-C, two USB 3.2 Gen 2 Type-A, four USB 2.0 and five USB 3.2 Gen 1 ports.

EZ-Latch And AI Software Features

M.2 EZ-Latch and PCIe EZ-Latch allow tool-free installation of drives and cards. Wi-Fi EZ-Plug simplifies antenna attachment. The BIOS includes X3D Turbo Mode, which can raise gaming frame rates by up to 18 percent on compatible Ryzen 9000 processors. AORUS AI SNATCH and HyperTune BIOS apply AI-driven overclocking and signal optimisation for memory and system tuning.

Puntos fuertes

  • Supports Ryzen 7000, 8000 and 9000 series processors with AM5 socket
  • DDR5 memory up to 8200 MT/s across four slots for 256 GB total capacity
  • PCIe 5.0 x16 slot plus two M.2 connectors for high-speed expansion
  • WIFI6E and 2.5 GbE LAN with Bluetooth for fast wireless and wired networking
  • EZ-Latch mechanisms on M.2 and PCIe slots simplify component installation

Especificaciones

BrandGIGABYTE
ModelB850M AORUS ELITE WIFI6E ICE
CPU Socket TypeAM5
CPU TypeRyzen 7000 Series / Ryzen 8000 Series / Ryzen 9000 Series
ChipsetAMD B850
Number of Memory Slots4x288pin (DDR5)
Memory StandardUp to DDR5 8200(O.C)
Maximum Memory Supported256GB
PCI Express 5.0 x161 x PCI Express 5.0 x16
M.22 x M.2
Max LAN Speed2.5Gbps
Wireless LANWi-Fi 802.11 ax
BluetoothYes
Back I/O Ports1 x DisplayPort / 1 x USB 3.2 Gen 2 Type-C / 2 x USB 3.2 Gen 2 Type-A / 4 x USB 2.0/1.1 / 5 x USB 3.2 Gen 1
Form FactorMicro ATX
Peso de envío1.81 kg
Dimensiones del paquete279 × 267 × 76 mm

Otras versiones de este modelo

5 más en esta gama

Misma familia, con memoria, disipador o frecuencia diferentes — compare antes de decidirse.

Preguntas sobre este artículo

How do I install a DDR5 module in the 288-pin slots and what step do people often miss?

Align the notch on the DDR5 stick with the key in the 288-pin slot, press down firmly until both side clips snap shut, then verify the BIOS detects the full 256 GB capacity.

Which onboard component will need attention or replacement after prolonged use?

The VRM and M.2 Thermal Guard heatsinks rely on case airflow; dust buildup reduces cooling efficiency, so clean the fins periodically to maintain the 12+2+2 power delivery temperatures.

What limit appears first when the board runs under sustained heavy load?

The 12+2+2 phase VRM thermal ceiling is reached before the PCIe 5.0 x16 or dual M.2 interfaces saturate, so adequate chassis ventilation becomes the limiting factor.

También en este pasillo

Los clientes también compararon

Mismo estante, mismo pago — ocho criptomonedas y un tipo de cambio fijado 30 minutos.