Iceberg Thermal DRIFTIce 120 x 40 x 1.5mm 13 W/mK

DRIFTIce Thermal Pad 120 x 40 mm

The DRIFTIce thermal pad is a 120 mm by 40 mm interface sheet designed for memory modules, graphics card components and notebook chipsets. It provides even contact across uneven surfaces to improve heat transfer in compact builds. The pad is non-electrically conductive and remains flexible for long-term use. Builders fitting standard height components will find the dimensions suit many common layouts.

Thickness 1.5 mm for specific gap clearance

This variant measures 1.5 mm thick, a critical dimension that must match the exact gap between the component and the heatsink or backplate. A pad that is too thin leaves air pockets while one that is too thick prevents proper mounting pressure. Check the manufacturer's service manual or measure the stack height before ordering. The 1.5 mm option addresses a narrower range of designs than the 1.0 mm or 2.0 mm alternatives.

13 W/mK conductivity across -40 to 200 °C

Rated at 13 W/mK thermal conductivity, the pad moves heat efficiently from VRAM, VRM or DRAM packages to the attached cooler. It operates continuously from -40 °C to 200 °C without hardening or corroding, maintaining performance through repeated thermal cycles. The 45 Shore 00 hardness ensures it conforms under typical mounting pressure without extruding. No active airflow or power is required for the pad itself.