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Two gray low-profile DDR5 memory modules side by side

KLEVV

KLEVV KD5BGUA80-60A300H 64GB (2×32GB) DDR5 6000 CL30 desktop RAM

SKU CH-7VDX-7HQ31 MPN KD5BGUA80-60A300H

Dual-channel 64 GB DDR5 kit running at 6000 MT/s with CL30 latency and 1.35 V operation

  • Capacity64GB (2 x 32GB)
  • SpeedDDR5 6000 (PC5 48000)
  • CAS LatencyCL30
  • Timing30-36-36-76
  • Voltage1.35V
  • Multi-channel KitDual Channel Kit

Capacity

  • 16GB x 2
  • 32GB x 2
  • 8GB x 2

Las versiones tachadas existen, pero no están disponibles aquí.

Speed DDR5 6000

Color Gray C30

  • 64 GB dual-channel capacity for high-density multitasking
  • DDR5 6000 speed with CL30 latency for responsive performance
  • 35 V operating voltage for reduced power draw
  • Intel XMP 3.0 and AMD EXPO profiles for one-click overclocking
  • On-die ECC and built-in PMIC for improved stability

Capacity and compatibility

This 64GB dual-channel kit uses two 32GB DDR5 modules rated at 6000 MT/s with CL30 timings. It targets enthusiasts and professionals who need high capacity for multitasking, content creation or gaming on modern AMD Ryzen and Intel platforms. The kit is validated for AMD 500, 600 and 800 series chipsets as well as Intel XMP 3.0 and AMD EXPO profiles.

Installation profile and common issues

The low-profile gray heatspreader clears most CPU coolers and fits tight spaces without extra effort. Installation follows standard DIMM seating; enable the EXPO or XMP 3.0 profile in BIOS to reach the rated 6000 MT/s speed. Stability depends on motherboard QVL listing, CPU memory-controller quality and adequate cooling; mismatched slots or outdated firmware are the usual causes of boot failures.

Sustained-load behaviour

On-die ECC and an integrated PMIC maintain voltage regulation at 1.35V during extended workloads. The 30-36-36-76 timing set remains consistent across long rendering or compilation sessions without thermal throttling. Reduced power draw limits heat soak, so performance stays stable rather than dropping after the initial burst.

Puntos fuertes

  • 64 GB dual-channel capacity for high-density multitasking
  • DDR5 6000 speed with CL30 latency for responsive performance
  • 35 V operating voltage for reduced power draw
  • Intel XMP 3.0 and AMD EXPO profiles for one-click overclocking
  • On-die ECC and built-in PMIC for improved stability

Especificaciones

BrandKlevv
ModelKD5BGUA80-60A300H
Capacity64GB (2 x 32GB)
SpeedDDR5 6000 (PC5 48000)
CAS LatencyCL30
Timing30-36-36-76
Voltage1.35V
Multi-channel KitDual Channel Kit
BIOS/Performance ProfileAMD EXPO / Intel XMP 3.0 / Intel XMP 3.0 and AMD EXPO
ColorGray
Recommend UseAMD & Intel Compatible / AMD 500 Series / AMD 600 Series / AMD 800 Series / AMD A520 / AMD B550 / AMD B650 / AMD B850 / AMD Ryzen Compatible / AMD WRX90 / AMD X570 / AMD X670 / AMD X870 / High Performance or Gaming Memory / Intel 500 Series / Intel 600 Series / Intel 700 Series / Intel 800 Series / Intel B560 / Intel B660 / Intel B670 / Intel B760 / Intel Compatible / Intel H770 / Intel Z590 / Intel Z690 / Intel Z790 / Intel Z890
LED ColorNone
Peso de envío0.09 kg
Dimensiones del paquete191 × 173 × 10 mm

Otras versiones de este modelo

5 más en esta gama

Misma familia, con memoria, disipador o frecuencia diferentes — compare antes de decidirse.

Preguntas sobre este artículo

How do I verify the kit is running at the advertised 6000 MT/s CL30 after enabling XMP or EXPO?

Open the BIOS or a tool such as CPU-Z and confirm the memory frequency shows 6000 MT/s with timings 30-36-36-76 at 1.35 V.

What does the box contain and is anything else required for installation?

The package includes two 32 GB DDR5 DIMMs for a 64 GB dual-channel kit; no extra cables or brackets are needed, just a compatible DDR5 motherboard.

This MPN is only sold as a 64 GB 6000 CL30 dual-channel kit — how do I decide if that capacity and speed suit my build?

Choose this 64 GB kit when you need maximum capacity on a two-slot board or four-slot board running 6000 MT/s CL30 via XMP 3.0 or EXPO; lower-capacity or slower kits exist under different part numbers.

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