BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
Me võtame vastu krüptoraha — nii saab teie hoitav krüptoraha osta päris riistvara.Makske krüptorahaga, kulutage seda päris riistvarale. Tasuta kindlustatud tarne kogu maailmas, üle 399 $. Lihtsad, kaubamärgita väliskarbid, saadetud Saksamaalt.Tasuta kindlustatud tarne üle 399 $. Teie kurss lukustatakse 30 minutiks kohe, kui kassa avaneb.Kurss lukustatud 30 minutiks. Iga toode on pitseeritud, selle seerianumber on kontrollitud ja sellel kehtib 24-kuuline garantii.Pitseeritud, 24-kuulise garantiiga.
Team Group
A dual-channel 32 GB kit of DDR4 3600 memory with CL18 timing and a gray aluminium heat spreader
This kit supplies 32GB of DDR4 memory in two 16GB unbuffered modules. It is built for desktop systems that need a dual-channel configuration and run at the rated 3600 speed with CL18 timings. The gray aluminum heat spreader uses an armor-style design and high-conductivity adhesive to protect the selected ICs.
Running at 1.35V with XMP 2.0 enabled, the modules maintain the 18-22-22-42 timing set during extended workloads rather than only in short bursts. The dual-channel layout keeps bandwidth stable for rendering, compilation or long gaming sessions without throttling caused by loose sub-timings.
The aluminum alloy spreader dissipates heat passively, so the kit adds no fan noise to the build. At the rated 1.35V the power draw stays low for DDR4 at this frequency, helping overall system thermals stay manageable inside typical mid-tower cases.
| Brand | Team |
|---|---|
| Series | T-FORCE DARK Z |
| Model | TDZGD432G3600HC18JDC01 |
| Capacity | 32GB (2 x 16GB) |
| Speed | DDR4 3600 (PC4 28800) |
| CAS Latency | CL18 |
| Timing | 18-22-22-42 |
| Voltage | 1.35V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Multi-channel Kit | Dual Channel Kit |
| BIOS/Performance Profile | Intel XMP 2.0 |
| Color | Gray |
| Heat Spreader | Aluminum |
| Features | Armor design for perfect protection Aluminum alloy heat sink with high performance High thermal conductive adhesive Supports Intel & AMD motherboards Selected high-quality IC Supports XMP2.0 Energy saving with ultra-low working voltage |
| Tarnekaal | 0.13 kg |
| Pakendi mõõtmed | 168 × 155 × 18 mm |
The aluminum alloy heat spreader uses high thermal conductive adhesive to move heat away from the selected ICs, and the 1.35V operating voltage keeps power draw low during extended workloads.
Your motherboard needs an Intel XMP 2.0 compatible BIOS so the dual-channel kit can load its 18-22-22-42 timings automatically at 3600 MT/s.
Yes, they are standard unbuffered non-ECC DDR4 DIMMs; mixing speeds or timings will force the board to run all modules at the slowest common settings.
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