BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
Vi tager imod kryptovaluta — så den krypto, du ejer, kan købe rigtig hardware.Betal med krypto, brug det på rigtig hardware. Gratis, forsikret levering til hele verden ved køb over 399 $. Neutrale, umærkede papkasser, sendt fra Tyskland.Gratis, forsikret levering over 399 $. Din kurs låses i 30 minutter, så snart kassen åbner.Kurs låst i 30 minutter. Hver vare er forseglet, har kontrolleret serienummer og er dækket af 24 måneders garanti.Forseglet, 24 måneders garanti.
Team Group
A dual-channel 32 GB kit of DDR4 3600 memory with CL18 timing and a gray aluminium heat spreader
This kit supplies 32GB of DDR4 memory in two 16GB unbuffered modules. It is built for desktop systems that need a dual-channel configuration and run at the rated 3600 speed with CL18 timings. The gray aluminum heat spreader uses an armor-style design and high-conductivity adhesive to protect the selected ICs.
Running at 1.35V with XMP 2.0 enabled, the modules maintain the 18-22-22-42 timing set during extended workloads rather than only in short bursts. The dual-channel layout keeps bandwidth stable for rendering, compilation or long gaming sessions without throttling caused by loose sub-timings.
The aluminum alloy spreader dissipates heat passively, so the kit adds no fan noise to the build. At the rated 1.35V the power draw stays low for DDR4 at this frequency, helping overall system thermals stay manageable inside typical mid-tower cases.
| Brand | Team |
|---|---|
| Series | T-FORCE DARK Z |
| Model | TDZGD432G3600HC18JDC01 |
| Capacity | 32GB (2 x 16GB) |
| Speed | DDR4 3600 (PC4 28800) |
| CAS Latency | CL18 |
| Timing | 18-22-22-42 |
| Voltage | 1.35V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Multi-channel Kit | Dual Channel Kit |
| BIOS/Performance Profile | Intel XMP 2.0 |
| Color | Gray |
| Heat Spreader | Aluminum |
| Features | Armor design for perfect protection Aluminum alloy heat sink with high performance High thermal conductive adhesive Supports Intel & AMD motherboards Selected high-quality IC Supports XMP2.0 Energy saving with ultra-low working voltage |
| Forsendelsesvægt | 0.13 kg |
| Pakkestørrelse | 168 × 155 × 18 mm |
The aluminum alloy heat spreader uses high thermal conductive adhesive to move heat away from the selected ICs, and the 1.35V operating voltage keeps power draw low during extended workloads.
Your motherboard needs an Intel XMP 2.0 compatible BIOS so the dual-channel kit can load its 18-22-22-42 timings automatically at 3600 MT/s.
Yes, they are standard unbuffered non-ECC DDR4 DIMMs; mixing speeds or timings will force the board to run all modules at the slowest common settings.
Også på denne hylde
Samme hylde, samme kasse — otte mønter og 30 minutters kurslås.
Det du betaler med, og det du ser priserne i.
Sendes fra din tegnebog i kassen
Kun til visning — kataloget er prissat i USD
Ingen valuta matcher det.
Vælg det sprog, siden taler til dig på.
Ingen sprog matcher.
Ny her?
Har du allerede en?
Der findes ingen automatisk nulstilling: denne butik sender ingen e-mails, så der er intet engangslink at bede om. Efterlad adressen på kontoen, så bliver den behandlet manuelt.
Anmodning registreret
Der er intet på vej til din indbakke — denne butik sender slet ingen e-mails. Nogen behandler dem manuelt.
Kom du i tanke om den?