EN-Labs 11-001-366 PCIe x4 USB 3.2 10Gbps 5-port card
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MAXSUN
Intel H610 back-connector YTX board for LGA 1700 12th and 13th Gen CPUs with DDR4 3200 dual-channel support up to 64 GB, PCIe 4.0 x16, four SATA, dual M.2 with heatsinks.
The MAXSUN DIY-APE H610-KING uses an LGA 1700 socket for Intel 12th and 13th generation processors with an H610 chipset. Its back-plug layout routes power, data and front-panel headers to the rear of the PCB for cleaner cable runs inside compatible YTX chassis. Two 288-pin slots support DDR4 dual-channel memory up to 64 GB at 3200 MT/s.
A single PCI Express 4.0 x16 slot handles the graphics card at 4.0 speeds. Four SATA 6 Gb/s ports and two M.2 sockets (one 22110 and one 2280, both PCIe 3.0 x4) provide drive expansion. The board also includes a CNVi slot for a Wi-Fi 6E module with Bluetooth 5.3. Rear I/O supplies one RJ45 port, DP and HDMI video, one USB-C 10 Gbps, one USB 5 Gbps, four USB 2.0 and three audio jacks.
Installation is straightforward only in cases designed for back-mounted motherboards; standard ATX standoffs will not align. The full-cover armor and dual M.2 heatsinks add bulk, so verify clearance before mounting. An external BIOS reset button simplifies recovery if memory training fails. Remember the 130 W power-phase rating when choosing a CPU cooler and power supply.
| Brand | MAXSUN |
|---|---|
| Model | DIY-APE H610-KING |
| CPU Socket Type | LGA 1700 |
| CPU Type | buffer_43521 |
| Chipset | Intel H610 |
| Number of Memory Slots | 2x288pin (DDR4) |
| Memory Standard | DDR4 3200 |
| Maximum Memory Supported | 64GB |
| Channel Supported | Dual Channel |
| PCI Express 4.0 x16 | 1 x PCI Express 4.0 x16 |
| Serial ATA (SATA) | 4 x SATA 6Gb/s |
| M.2 | 2 x M.2 |
| Back I/O Ports | RJ45 network card 1 Video output port DP+HDMI WiFi reserved CNVi USB-C 1(USB2.0) audio 3 holes BIOS reset yes (external) USB-5G 4 USB-2.0 4 |
Use the 22110 slot for the primary SSD if your drive is that length; the 2280 slot works for standard drives and both run at PCIe 3.0 x4 speeds.
The 130 W rating covers the 4+1+1 phase VRM, so it handles 12th and 13th Gen LGA1700 processors within that thermal envelope.
The rear USB-C is specified at 10 Gbps, while the front-panel USB-C header is limited to USB 2.0 speeds.
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