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Square grey silicone thermal pad 100 by 100 by 2.5 mm

UPSIREN

UPSIREN OEM 18W 100x100x2.5mm thermal pad

SKU CH-50K3-FAMNM

A 100 × 100 × 2.5 mm silicone thermal pad rated at 18 W/mK conductivity for CPU, GPU and heatsink gap filling

  • Volume / Net Weight23g
  • Thermal Conductivity18W/mk
  • Long Term Operating Temperature-40 to 200 C
  • FeaturesNon-Corrosive, Non-Curing & Non-Toxi

Option 100*100*2.5mm

  • 100 x 100 x 3.0 mm
  • 100 x 100 x 0.5 mm
  • 100 x 100 x 2.0 mm
  • 100 x 100 x 1.5 mm
  • 100 x 100 x 1.0 mm
  • 100*100*2.5mm

취소선으로 표시된 버전은 존재하지만, 이곳에서는 취급하지 않습니다.

  • 18 W/mK thermal conductivity moves heat fast
  • 100 × 100 × 2.5 mm pad fits many chips
  • Non-conductive silicone keeps circuits safe
  • Soft 30 Shore hardness conforms to surfaces
  • Operates from –40 °C to 200 °C without melting

UPSIREN OEM 18W Thermal Pad

The UPSIREN OEM 18W thermal pad is a 100 by 100 millimetre silicone interface with 2.5 millimetre thickness. It targets builders and technicians who need a non-conductive gap filler for GPU, CPU, laptop heatsink or LED cooler applications. The material is rated for long-term operation between minus 40 and 200 degrees Celsius.

Non-curing silicone with natural viscosity

The pad ships as a single 23 gram piece that remains soft at 30 degrees Shore hardness, allowing it to compress and conform to uneven surfaces without curing over time. Its non-corrosive, non-toxic composition prevents damage to metal components while providing electrical insulation. Natural tackiness aids placement and permits removal for rework or reuse.

Insulated construction suits dense assemblies

Electrical insulation means the pad can bridge components and heatsinks without risk of short circuits in tightly packed layouts. The 18 W per metre kelvin conductivity rating supports heat transfer across the 2.5 millimetre gap in industrial, automotive, communications and consumer electronics environments. The 100 by 100 millimetre format can be trimmed to fit smaller contact areas.

주요 특징

  • 18 W/mK thermal conductivity moves heat fast
  • 100 × 100 × 2.5 mm pad fits many chips
  • Non-conductive silicone keeps circuits safe
  • Soft 30 Shore hardness conforms to surfaces
  • Operates from –40 °C to 200 °C without melting

사양

BrandUPSIREN
SeriesOEM
Model18W
Volume / Net Weight23g
Thermal Conductivity18W/mk
Long Term Operating Temperature-40 to 200 C
FeaturesNon-Corrosive, Non-Curing & Non-Toxi

이 모델의 다른 버전

같은 라인업에서 5개 더

같은 제품군에서 메모리·쿨러·클럭이 다릅니다 — 결정 전에 비교해 보세요.

이 상품에 대한 질문

Does the pad degrade or need replacing after long-term use at high temperature?

The pad is non-curing and non-toxic, rated for continuous operation from -40 to 200 °C, so it does not dry out or require scheduled replacement.

What limits cooling performance when the pad is compressed between a chip and heatsink for extended periods?

Thermal conductivity is 18 W/mK and the material hardness is 30 degrees, allowing sustained compression without losing contact or conductivity.

How much heat does the pad itself generate or retain during all-day operation?

The silicone pad is electrically non-conductive and non-corrosive, adding no active heat; it simply transfers up to 18 W/mK across the 2.5 mm thickness.

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고객들이 함께 비교한 상품

같은 진열대, 같은 체크아웃 — 코인 8종, 환율 잠금 30분.