NEMIX RAM 64GB DDR4 3200 4Rx4 1.2V 288-PIN ECC LRDIMM server RAM
- DDR4 3200 (PC4 2560…
- 22
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A-Tech
8GB DDR3 1600 ECC registered DIMM with CL11 latency and 1.5V operation for Dell 370-AAVV servers
This 8 GB module runs at DDR3 1600 (PC3-12800) with CL11 latency and 1.50 V standard voltage. It is a 1Rx4 registered ECC DIMM built with major-brand chips for Dell 370-AAVV server and workstation platforms. The 240-pin form factor fits compatible DDR3 slots in enterprise systems. Buyers who need a different capacity, speed, or unbuffered memory should look elsewhere.
Operating at the standard 1.50 V DDR3 voltage keeps power draw within normal limits for registered server memory. The module produces no audible noise because it has no moving parts. Heat output is typical for a single 8 GB DDR3 RDIMM under everyday workloads. Systems without adequate airflow for populated DIMM slots may run warmer.
Quality-assurance testing validates dependable performance during extended server and workstation sessions. Registered buffering and ECC correction maintain data integrity when the module handles continuous multi-threaded workloads. The major-brand chipset supports stable operation over long periods without throttling. Workloads that exceed the 8 GB capacity of a single module will require additional compatible DIMMs.
| Brand | A-Tech |
|---|---|
| Capacity | 8GB |
| Speed | DDR3 1600 (PC3 12800) |
| CAS Latency | CL11 |
| Voltage | 1.50V |
| ECC | Yes |
| Buffered/Registered | Registered |
| Rank | 1Rx4 |
| Chipset | Major Brand Chipset |
| Features | Major Brand Chips |
Power down, open the chassis, align the notch on the 240-pin module with the slot key, press firmly until both retention clips click, then verify in BIOS that the 8GB module registers at 1600MHz with ECC active.
No routine maintenance is required; the module either runs reliably for the system's life or fails outright, at which point you replace it with another DDR3 1600 ECC RDIMM of matching rank and voltage.
The 1600MHz DDR3 bus bandwidth and CL11 latency ceiling become the bottleneck before the 1.50V thermal envelope, capping sustained throughput on memory-intensive server tasks.
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