NEMIX RAM 64GB DDR4 3200 4Rx4 1.2V 288-PIN ECC LRDIMM server RAM
- DDR4 3200 (PC4 2560…
- 22
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AMD
16-core server processor with 768 MB L3 cache, 3.05 GHz base and 3.8 GHz boost, DDR4-3200 eight-channel memory and 128 PCIe 4.0 lanes
The AMD EPYC 7373X is a 16-core, 32-thread server processor built for workloads that demand large L3 cache. It operates at a 3.05 GHz base frequency and reaches a 3.8 GHz maximum turbo frequency. The 768 MB L3 cache is the defining feature, targeting databases and virtualisation hosts that benefit from high hit rates. This Socket SP3 part fits platforms qualified for the EPYC 7003 series.
The processor carries a 240 W thermal design power, so cooling must handle sustained heavy loads across all 16 cores. Eight memory channels run DDR4 at 3200 MT/s, feeding data to the cores without bottlenecking the large cache. PCI Express 4.0 provides 128 lanes for high-bandwidth storage and networking cards. No integrated graphics are present, leaving all power budget for compute.
The 768 MB L3 cache is the single specification that determines whether this CPU matches the workload. Applications with large working sets — in-memory databases, dense virtualisation, or heavy simulation — see reduced latency and higher throughput. Buyers whose software fits in smaller caches will not utilise the extra capacity and should evaluate lower-cache alternatives.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7003 |
| Name | EPYC 7373X |
| Model | 100-000000508 |
| CPU Socket Type | Socket SP3 |
| # of Cores | 16-Core |
| # of Threads | 32 |
| Operating Frequency | 3.05 GHz |
| Max Turbo Frequency | 3.8 GHz |
| L3 Cache | 768MB |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 240W |
| Shipping weight | 0.82 kg |
| Package size | 152 × 152 × 102 mm |
Align the gold triangle on the processor with the socket marker, lower it evenly without force, then close the retention lever and torque the captive screws in a cross pattern to the board-maker's specified value; skipping the torque sequence can leave uneven contact.
The processor itself has no user-serviceable parts; plan to replace thermal paste every two to three years and verify heatsink mounting pressure whenever the server is opened for memory or PCIe changes.
The 240 W thermal design power is the first hard ceiling; the cooling solution must dissipate that heat continuously or the processor will throttle to stay within its thermal envelope.
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