NEMIX RAM 64GB DDR4 3200 4Rx4 1.2V 288-PIN ECC LRDIMM server RAM
- DDR4 3200 (PC4 2560…
- 22
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AMD
32-core server processor with 64 threads, 2.6 GHz base clock, 3.65 GHz max turbo, 128 MB L3 cache, 200 W TDP, DDR4-3200 support and PCIe 4.0 with 128 lanes
The AMD EPYC 7513 is a 32-core server CPU built for the SP3 socket. It targets data-centre operators who need high core density and eight-channel DDR4-3200 memory bandwidth. The processor runs at a 2.6 GHz base clock with a 3.65 GHz maximum turbo frequency. It is sold without a cooling solution.
The CPU requires a motherboard with an SP3 socket and a platform qualified for the EPYC 7003 series. It provides 128 PCIe 4.0 lanes and supports eight memory channels. A 200 W thermal design power means the chassis and power delivery must handle that heat load. Systems still running older EPYC generations cannot accept this part.
The processor drops into the SP3 LGA socket using the server board’s retention mechanism; no consumer-style lever is present. Because no cooler is included, a compatible SP3 heatsink or liquid block must be sourced separately. Common issues are bent socket pins during handling and insufficient mounting pressure causing thermal throttling. Apply thermal paste evenly before securing the cooler.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7003 |
| Name | EPYC 7513 |
| Model | 100-000000334 |
| CPU Socket Type | Socket SP3 |
| Core Name | Milan |
| # of Cores | 32-Core |
| # of Threads | 64 |
| Operating Frequency | 2.6 GHz |
| Max Turbo Frequency | 3.65 GHz |
| L3 Cache | 128MB |
| 64-Bit Support | Yes |
| Manufacturing Tech | 7 nm |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| Virtualization Technology Support | Yes |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 200W |
| Cooling Device | Cooling device not included - Processor Only |
| Shipping weight | 0.82 kg |
| Package size | 152 × 152 × 102 mm |
The processor runs at 2.6 GHz across all 32 cores under continuous load and can boost up to 3.65 GHz on fewer cores when thermal headroom allows, giving consistent throughput for server tasks.
The platform provides 128 lanes of PCIe 4.0 bandwidth, which sets the maximum number of high-speed devices such as GPUs, storage controllers or network adapters that can operate at full Gen 4 speed simultaneously.
The SP3 LGA socket needs a compatible server motherboard and a heatsink rated for at least 200 W TDP; no cooler is included, so a qualified SP3 mounting kit must be sourced separately.
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