AMD EPYC 7302 100-100000043WOF 16-core 3.0 GHz server processor
- EPYC 7302
- Socket SP3
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AMD
32-core server processor with 2.9 GHz base and 3.4 GHz boost, 128 MB L3 cache, 8-channel DDR4 3200 support, 128 PCIe 4.0 lanes and 225 W TDP in Socket SP3
The AMD EPYC 7542 is a 32-core, 64-thread server CPU built for Socket SP3 platforms. It runs at a 2.9 GHz base frequency and reaches a 3.4 GHz maximum boost clock. The processor provides 128 MB of L3 cache and 16 MB of L2 cache alongside an integrated DDR4-3200 memory controller with eight channels.
This processor fits 1P and 2P configurations that need 128 lanes of PCIe 4.0 connectivity for dense I/O. Buyers who require an included cooler should look elsewhere because the package contains the processor only. Systems limited to lower TDP envelopes or fewer memory channels will not match the 225 W design point or the eight-channel architecture.
The 225 W thermal design power is the single figure that determines whether a chassis, power supply and cooler can support this part. Without a cooling solution in the box, the builder must provision adequate heat dissipation for sustained 2.9 GHz operation across all 32 cores.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7002 |
| Name | EPYC 7542 |
| Model | 100-100000075WOF |
| CPU Socket Type | Socket SP3 |
| # of Cores | 32-Core |
| # of Threads | 64 |
| Operating Frequency | 2.9 GHz |
| Max Turbo Frequency | 3.4 GHz |
| L3 Cache | 128MB |
| 64-Bit Support | Yes |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 225W |
| Cooling Device | Cooling device not included - Processor Only |
| Shipping weight | 0.91 kg |
| Package size | 305 × 229 × 102 mm |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
The processor ships without a cooling device, so a compatible SP3 cooler rated for 225 W must be sourced separately; no user-serviceable parts exist on the CPU itself.
With a 225 W TDP and 8-channel DDR4-3200 memory, the thermal envelope typically becomes the binding constraint before memory bandwidth saturates.
Sustained 225 W output demands robust airflow; expect significant case heat and fan noise proportional to the cooler chosen for the SP3 socket.
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