ARCTIC COOLING MX-4 AC-MX4 thermal paste 8g
- Thermal Conductivit…
- Non-Capacitive, Non…
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ARCTIC COOLING
Carbon-microparticle thermal compound with 8.5 W/mK conductivity, non-conductive and non-curing for CPU and GPU
Weight 2 g
Struck-through versions exist but are not stocked here.
Option N/A
ARCTIC MX-4 is a carbon microparticle thermal compound designed for CPU and GPU heat transfer. The non-conductive formula eliminates electrical risk if paste spreads beyond the die. It suits builders who want reliable performance without the hazard of metal-based pastes.
Unlike metal or silicon compounds, this material does not cure, bleed or corrode over time. The jump is worth it when replacing dried-out stock paste or conductive compounds that risk shorting components. Long-term stability means re-application intervals can be extended.
The 2g syringe dispenses cleanly for direct die or spread application on desktop and laptop coolers. Low thermal resistance of 8.5 W/mK and viscosity of 870 poise allow thin, even layers without specialized tools. Density of 2.5 g/cm3 ensures the paste stays in place under mounting pressure.
| Brand | ARCTIC COOLING |
|---|---|
| Series | Arctic Cooling MX-4 |
| Model | AC-MX4 |
| Specifications | Thermal Conductivity (W/mk): 8.5Viscosity (poise): 870Density (g/cm3): 2.5Net Weight: 2gThe ARCTIC MX-4 is a premium-grade thermal paste with exceptional performance and ease of application. It is an electrically non-conductive paste that is applied between CPU / GPU and designated coolers to transfer the dissipated heat from the components to the heat sink. Since the ARCTIC MX-4 is a metal-free compound, it eliminates the risks of causing short circuit and in turn adding more protection to your computer.The new formula in the ARCTIC MX-4 features optimal thermal conductivity and low |
| Features | Non-Capacitive, Non-Electricity-Conductive, Carbon-Micro particle Based Thermal Compound Non-Curing, Non-Corrosive, Non-Bleeding, Excellent for CPU / GPU / Electronics / Lighting Cooling Low Thermal Resistance / High Thermal Conductivity Dissipating Heat EfficientlyWill Not Short / Damage Delicate Circuitry Like Silver / Metallic-Based Compound High Viscosity, Easy-Application Syringe, Superb Durability - 2g Syringe Retail Package |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
The 2g syringe dispenses directly through its built-in nozzle; no separate tip is required and the paste's 870 poise viscosity allows controlled placement on the CPU heat spreader.
Place a pea-sized drop in the centre of the CPU, then mount the cooler straight down — the pressure spreads the 8.5 W/mK paste evenly without trapping air.
The carbon microparticle formula is non-curing and non-bleeding, so it maintains its 2.5 g/cm³ density and does not degrade like metal or silicone compounds.
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