OWC 16GB DDR4 3200MHz CL22 1.2V 260pin SODIMM Alienware X17 R1
- 16GB
- 260-Pin DDR4 Non-EC…
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Computer Memory Solutions
16GB DDR3-1333 ECC registered 240-pin kit for Dell PowerEdge R610 servers
This 16 GB kit delivers two 8 GB DDR3 registered ECC modules rated at 1333 MHz with CL9 timing. It is built specifically for the Dell PowerEdge R610 and runs at the standard 1.5 V for this platform. The matched pair enables dual-channel operation on supported Xeon configurations.
Each stick uses the 240-pin DDR3 form factor and includes the register buffer required by the R610 memory controller. The registered design places less electrical load per channel, allowing the system to populate up to twelve sockets across two CPUs. Modules are supplied without a heat spreader unless current inventory includes one.
The package contains exactly two DIMMs so the installer can populate a matched bank immediately. CMS guarantees compatibility with the R610 and backs the modules with a limited lifetime warranty when purchased directly. Builders needing more than 16 GB or a different rank configuration should verify the server’s bank population rules before ordering.
| Brand | Computer Memory Solutions |
|---|---|
| Model | CM10247210600ECCR2R4H |
| Capacity | 16GB (2 x 8GB) |
| Type | 240-Pin DDR3 SDRAM |
| Speed | DDR3 1333 (PC3 10600) |
| CAS Latency | CL9 |
| Timing | 9-9-9 |
| Voltage | 1.5V |
| ECC | Yes |
| Buffered/Registered | Registered |
| Rank | 2Rx4 |
| Chipset | Major Brand Chipset |
| Heat Spreader | Based on Current Inventory (If Required Please Contact) |
| Compatible System | Dell Poweredge R610 |
| Package Content | 2 Memory RAM Sticks |
The modules will clock down to 1066 MHz or 800 MHz depending on the Xeon model and how many banks are populated; full 1333 MHz is not guaranteed.
Yes, the 240-pin DDR3 registered form factor matches the R610's 12 DIMM sockets across two CPUs.
Populate one DIMM per channel (three sockets per CPU) to enable triple-channel mode; do not mix registered and unbuffered ECC in the same system.
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