OWC 16GB DDR4 3200MHz CL22 1.2V 260pin SODIMM Alienware X17 R1
- 16GB
- 260-Pin DDR4 Non-EC…
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Computer Memory Solutions
32 GB kit of two 16 GB DDR4-2400 CL17 DIMMs validated for ASUS ROG Maximus X and XI Code, Formula and Hero boards
This 32 GB kit is built for ASUS ROG Maximus X Code, Formula, Hero and Hero (WI-FI AC) plus the Maximus XI Code. Two 16 GB modules fill two of the four DIMM slots and reach the board's 64 GB maximum. Buyers who need more than two modules or who use a different motherboard should look elsewhere.
The pair runs at DDR4 2400 (PC4 19200) with 17-17-17 timings at 1.2 V. Unbuffered, non-ECC operation matches the platform's standard memory controller. No heat spreader is included, so airflow over the sticks is left to the case and CPU cooler.
Each stick uses a 2Rx8 major-brand chipset on a standard 288-pin PCB without a spreader. The manufacturer backs the modules with a lifetime exchange or repair warranty against manufacturing defects when purchased directly. Builders who prefer tall heat spreaders or RGB lighting will need a different kit.
| Brand | Computer Memory Solutions |
|---|---|
| Model | CM2048642400DIMM |
| Capacity | 32GB (2 x 16GB) |
| Type | 288-Pin DDR4 SDRAM |
| Speed | DDR4 2400 (PC4 19200) |
| CAS Latency | CL17 |
| Timing | 17-17-17 |
| Voltage | 1.2V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Rank | 2Rx8 |
| Chipset | Major Brand Chipset |
| Heat Spreader | No |
| Compatible System | ASUS/ASmobile ROG Maximus X Code, ROG Maximus X Formula, ROG Maximus X Hero (WI-FI AC), ROG Maximus X Hero, ROG Maximus XI Code |
| Package Content | 2 Memory RAM Sticks |
The modules use a 2Rx8 rank layout that is fixed at manufacture; no rank changes are possible later, so the only replacement would be a complete kit swap if capacity needs grow.
The 1.2 V operating voltage and CL17 timing set the thermal and stability ceiling; sustained loads will hit the voltage-temperature envelope before bandwidth saturates.
Each 16 GB stick draws 1.2 V without a heat spreader, so total kit power stays modest and cooling relies on case airflow over the bare PCB.
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