EN-Labs 11-001-366 PCIe x4 USB 3.2 10Gbps 5-port card
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Computer Memory Solutions
8GB DDR3 SODIMM kit, two 4GB CL7 modules validated for Compaq G62 notebooks
This 8 GB kit contains two 4 GB DDR3 SODIMM modules rated at 1333 MHz with CL7 timing. It is built for Compaq G Notebook G62 series laptops including the G62-140US and G62-340US models. The 204-pin unbuffered sticks run at 1.5 V and use major-brand chips.
Owners of compatible G62 notebooks with two free slots can install the pair for the full 8 GB capacity. Systems limited to a 32-bit operating system or an Intel GL40 chipset will not recognise more than 4 GB total. Buyers with only one slot available or a different laptop line should look elsewhere.
The modules operate at DDR3 1333 (PC3 10600) with 7-7-7 latency at 1.5 V. This speed and timing combination determines whether the memory matches the notebook's memory bus, which may run at 1066 MHz depending on the installed processor.
| Brand | Computer Memory Solutions |
|---|---|
| Model | CM5126410600SODRH |
| Capacity | 8GB (2 x 4GB) |
| Type | 204-Pin DDR3 SO-DIMM |
| Speed | DDR3 1333 (PC3 10600) |
| CAS Latency | CL7 |
| Timing | 7-7-7 |
| Voltage | 1.5V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Rank | 2Rx8 |
| Chipset | Major Brand Chipset |
| Heat Spreader | No |
| Compatible System | Compaq G Notebook G62 Series, G62-140Us, G62-340Us |
| Package Content | 2 Memory RAM Sticks |
The kit runs at 1333 MHz with a CAS latency of 7 cycles, giving a theoretical peak bandwidth of PC3-10600. In the target Compaq G62 models the memory bus may drop to 1066 MHz (PC3-8500) depending on the installed processor.
Each module uses the standard 204-pin DDR3 SO-DIMM form factor, so it fits the two memory sockets in the G62 series. The chipset caps total usable memory at 4 GB on 32-bit Windows or 8 GB on 64-bit Windows, and Intel GL40-based units cannot exceed 4 GB regardless of OS.
The sticks are standard-height unbuffered SO-DIMMs without heat spreaders, so they occupy the two horizontal memory slots under the bottom access panel. No extra vertical clearance or cooling airflow is required beyond the factory design.
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