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Corsair

Corsair Vengeance LPX CMK16GX4M2B3200C16 16GB (2x8GB) DDR4 3200 CL16 desktop RAM

SKU CH-MZJP-H9YK2 MPN CMK16GX4M2B3200C16

16 GB dual-channel DDR4 kit running at 3200 MHz with CL16 latency, 1.35 V voltage and low-profile aluminium heatspreaders

  • Capacity16GB (2 x 8GB)
  • Type288-Pin PC RAM
  • SpeedDDR4 3200 (PC4 25600)
  • CAS LatencyCL16
  • Timing16-18-18-36
  • Voltage1.35V
  • 16 GB dual-channel kit enables smooth multitasking
  • DDR4 3200 CL16 delivers responsive system performance
  • Intel XMP 2.0 profile simplifies one-click overclocking
  • Pure aluminum heatspreader improves thermal management
  • Low-profile design fits compact builds and large coolers

Low-profile DDR4 kit for overclocking

This 16 GB kit contains two 8 GB DDR4 modules rated at 3200 MT/s with CL16 timings. The low-profile heatspreader fits comfortably under large CPU coolers and in compact cases. It targets builders who want reliable XMP 2.0 performance without clearance headaches.

Aluminium heatspreader and eight-layer PCB

A pure aluminium heatspreader pulls heat away from the DRAM while the eight-layer PCB improves thermal management and signal integrity. At the rated 1.35 V the modules run cool and quiet with no active cooling required. Power draw stays within standard DDR4 limits for the rated speed.

Intel XMP 2.0 profile and broad platform list

The kit ships with a single XMP 2.0 profile that sets 3200 MT/s at 16-18-18-36 timings automatically on supporting motherboards. Compatibility is validated across Intel 200, 300, 400, 500 and 600 series as well as X299, plus AMD 300, 400, 500 and X570 platforms. No extra software is needed beyond enabling the profile in BIOS.

Highlights

  • 16 GB dual-channel kit enables smooth multitasking
  • DDR4 3200 CL16 delivers responsive system performance
  • Intel XMP 2.0 profile simplifies one-click overclocking
  • Pure aluminum heatspreader improves thermal management
  • Low-profile design fits compact builds and large coolers

Specifications

BrandCORSAIR
SeriesVengeance LPX
ModelCMK16GX4M2B3200C16
Capacity16GB (2 x 8GB)
Type288-Pin PC RAM
SpeedDDR4 3200 (PC4 25600)
CAS LatencyCL16
Timing16-18-18-36
Voltage1.35V
BIOS/Performance ProfileIntel XMP 2.0
ColorBlack
Heat SpreaderVengeance LPX memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the eight-layer PCB helps manage heat and provides superior overclocking headroom. Each IC is individually screened for performance potential.
The DDR4 form factor is optimized for the latest Intel 100 Series motherboards and offers higher frequencies, greater bandwidth, and lower power consumption than DDR3 modules. Vengeance LPX DDR4 modules are compatibility-tested across 100 Series motherboards for reliably fast performance. There’s XMP 2.
FeaturesDesigned for high-performance overclocking
Each Vengeance LPX module is built with a pure aluminum heatspreader for faster heat dissipation and cooler operation; and the eight-layer PCB helps manage heat and provides superior overclocking headroom.
Each IC is individually screened for performance potential.
Designed for great looks
Available in multiple colors to match your motherboard, your components, or just your style.
Performance and Compatibility
Vengeance LPX is optimized and compatibility tested for the latest Intel 100 Series motherboards and offers higher frequencies, great
Recommend UseAMD 300 Series / AMD 400 Series / AMD X570 / Intel 200 Series / Intel 300 Series / Intel 400 Series / Intel X299 / AMD 500 Series / Intel 500 Series / Intel 600 Series
Shipping weight0.10 kg
Package size155 × 89 × 13 mm

Questions about this item

How do I install the 288-pin DIMM modules and what step is often missed?

Align the notch on each module with the slot key, press down firmly until both side clips click shut, then enable the Intel XMP 2.0 profile in BIOS so the kit runs at DDR4 3200 CL16 instead of the default speed.

What maintenance or replacement will the Vengeance LPX kit need over time?

The pure aluminum heatspreader and eight-layer PCB are passive with no moving parts, so no routine maintenance is required; replacement would only be necessary if a module fails or a future platform demands a different memory generation.

What limit appears first during sustained heavy workloads?

The modules are rated for DDR4 3200 at 1.35 V with CL16-18-18-36 timings; pushing voltage or frequency beyond the XMP 2.0 profile typically hits thermal or stability limits before the rated speed becomes a bottleneck.

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