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DELL

DELL PowerEdge R740 2U rack server 2× Xeon Platinum 8160 2.1 GHz 24-core 256 GB DDR4 8× 400 GB SSD H730P

SKU CH-KN8Q-SAKJ2

2U rack server with dual 24-core Xeon Platinum 8160 CPUs, 256 GB DDR4 ECC memory, eight 400 GB SATA SSDs on an H730P RAID controller, quad-port 1 GbE and 10 GbE SFP+ networking.

  • TypeRack
  • Rack Height2U
  • Redundant Hot-swap PowerYes
  • CPU TypeIntel Xeon
  • CPU Speed2.10 GHz
  • CPU SocketLGA 3647
  • Dual Xeon Platinum 8160 CPUs provide 24 cores each at 2.1 GHz base
  • 256 GB DDR4 registered ECC memory installed across 8 modules
  • PERC H730P controller supports RAID 0 1 5 6 10 50 60 with 2 GB cache
  • Eight 400 GB SATA SSDs deliver fast read performance in 2.5 inch bays
  • Dual 750 W platinum power supplies with hot-swap redundancy and iDRAC 9 Enterprise remote management

DELL PowerEdge R740 2U rack server

The DELL PowerEdge R740 is a 2U rack server built for compute-intensive workloads. It ships with two Intel Xeon Platinum 8160 processors, each delivering 24 cores at 2.1 GHz with a 3.7 GHz turbo frequency. The system includes 256 GB of DDR4 2666 MHz registered ECC memory across eight 32 GB modules. Eight 400 GB SATA SSDs provide high-speed storage out of the box.

Dual 750 W Platinum redundant power supplies

Redundant hot-swap 750 watt platinum-efficiency power supplies maintain uptime during a module failure. The 2U chassis uses forced-air cooling designed for dense dual-socket configurations. The PERC H730P controller with 2 GB cache and battery backup manages RAID 0, 1, 5, 6, 10, 50 and 60 across the eight drive bays. iDRAC 9 Enterprise enables remote monitoring of thermals and power draw without host OS involvement.

24 DIMM slots and eight 2.5-inch bays

Twenty-four DDR4 slots support up to 3 TB of memory for future expansion beyond the installed 256 GB. Two LGA 3647 sockets are fully populated, leaving no room for additional processors. The Intel X520/I350 daughter card adds two 1 GbE and two 10 Gb SFP+ ports for flexible network connectivity. Ready Rails and a front bezel are included for standard rack mounting.

Highlights

  • Dual Xeon Platinum 8160 CPUs provide 24 cores each at 2.1 GHz base
  • 256 GB DDR4 registered ECC memory installed across 8 modules
  • PERC H730P controller supports RAID 0 1 5 6 10 50 60 with 2 GB cache
  • Eight 400 GB SATA SSDs deliver fast read performance in 2.5 inch bays
  • Dual 750 W platinum power supplies with hot-swap redundancy and iDRAC 9 Enterprise remote management

Specifications

BrandDELL
SeriesPowerEdge R740
ModelR740
TypeRack
Rack Height2U
Redundant Hot-swap PowerYes
CPU TypeIntel Xeon
CPU Speed2.10 GHz
CPU SocketLGA 3647
Number of CPU Cores24-Core Processor
# of Processors Installed2
MAX Processors2
ChipsetIntel C620
Installed Memory Size256GB
Memory TypeDDR4
Max Memory Capacity3TB
Number of Memory Slots24
Storage ControllerDell Perc H730P 2GB Controller
HDD InterfaceSATA
SSD (Installed)8 x 400GB SATA SSD
Raid LevelRAID 0/1/5/6/10/50/60
GPU TypeMatrox G200
Video Memory8MB
Ethernet ControllerDell Intel X520/I350 Quad Port 2x 1GbE 2x 10Gb SFP+ Network Daughter Card
LAN Ports4 x Ports
Expansion SlotsRiser options with up to 8 PCIe Gen 3 slots, maximum of 4 x 16 slots
Management PortRJ 45
Operating SystemNo
Features8 x 2.5" SATA/SAS Hot-Plug Drive Bays

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Questions about this item

How do I install the Dell PERC H730P controller and what step is often missed?

Seat the H730P in the dedicated internal slot, connect the SAS cables to the backplane, then attach the RAID battery pack and enable the controller in the BIOS before creating virtual disks.

What maintenance will the 8× 400 GB SATA SSDs require over time?

Monitor SSD wear via the PERC H730P or iDRAC9 Enterprise; replace any drive once its media-wear indicator reaches the rated limit to keep the RAID array healthy.

What thermal limit appears first when both Xeon Platinum 8160 CPUs run at 3.7 GHz turbo under sustained load?

The 750 W redundant power supplies and 2U chassis airflow set the practical ceiling; prolonged all-core turbo will hit the platform power budget before CPU junction temperature becomes the bottleneck.

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