Phanteks PH-F120M25R_G2_DWT01_3P 3x 120mm case fan
- 3 Fans
- No Controller
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Dynatron
Copper heatsink with vapor chamber base fits 1U servers and includes pre-applied Shin-Etsu 7762 thermal grease
The Dynatron B6 is a 27 mm copper stacked-fin heatsink with an integrated vapor-chamber base. It weighs 420 g and measures 90.00 x 90.00 x 27.00 mm. The unit is built for Intel Xeon Platinum and Gold processors in a Socket FCLGA3647 square ILM. It ships with Shin-Etsu 7762 thermal grease pre-printed on the base.
This cooler fits 1U server chassis and supports CPU power up to the rated limit. It is not intended for desktop sockets or tower cases that require taller coolers. Builders needing active airflow or larger radiator surfaces should consider alternative solutions. The passive design relies entirely on system airflow.
The factory-applied Shin-Etsu 7762 thermal compound eliminates the need for separate paste application. This reduces installation time and ensures consistent coverage across the vapor-chamber base. No additional mounting hardware or software utilities are included in the package.
| Brand | Dynatron |
|---|---|
| Model | B6 |
| Type | Heatsinks only |
| Heatsink Material | Copper1100 Stacked Fin Heatsink with Vapor Chamber Base |
| Max CPU Cooler Height | 27 mm |
| Heatsink Dimensions | 90.00 x 90.00 x 27.00 mm |
| Weight | 420g |
| Features | Solution: 1U Server and Up Thermal Grease : Shin-Etsu 7762 Pre-printed |
| Shipping weight | 0.49 kg |
| Package size | 132 × 112 × 61 mm |
Yes, the B6 is designed for Socket FCLGA3647 with a Square ILM, so the motherboard must already have that retention mechanism installed.
The cooler stands 27 mm tall and is built for 1U server and up, so it fits within the typical 1U vertical clearance envelope.
Check that the pre-printed Shin-Etsu 7762 layer has spread evenly across the copper vapor-chamber base and that CPU temperatures remain stable under load.
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