Micron Technology, Inc. MT4JTF12864AZ-1G4D1 1GB DDR3 1333 Desktop RAM
- 1GB
- DDR3 1333 (PC3 1060…
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G.SKILL
4GB DDR3 1600 desktop module with CL9 timing, 1.50V operation and a heat spreader for Intel LGA1155/LGA1156 and AMD AM3 platforms
This G.SKILL Ripjaws module provides 4GB of DDR3 1600 memory for desktop systems. It operates at PC3 12800 speed with CL9 latency and 1.50V voltage. The unbuffered, non-ECC design includes a heat spreader for thermal management.
This kit suits owners of Intel LGA1155 or LGA1156 platforms and AMD AM3, Llano or AM3+ platforms seeking a 4GB DDR3 upgrade. Intel XMP support simplifies configuration on 1st to 3rd Generation Core processors. Systems requiring ECC, registered modules, or a different DDR generation should select alternative memory.
The decisive specification is the 240-pin DDR3 1600 interface with CL9 9-9-9-24-2N timing at 1.50V. Only motherboards supporting DDR3 at this pin count and voltage can use this module. Verify the platform matches the listed Intel and AMD sockets before purchase.
| Brand | G.SKILL |
|---|---|
| Series | Ripjaws Series |
| Model | F3-12800CL9S-4GBRL |
| Capacity | 4GB |
| Type | 240-Pin PC RAM |
| Speed | DDR3 1600 (PC3 12800) |
| CAS Latency | CL9 |
| Timing | 9-9-9-24-2N |
| Voltage | 1.50V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Color | N/A |
| Heat Spreader | Yes |
| Features | Compatible with Intel LGA1155/LGA1156 and AMD AM3/Llano/AM3+ platforms Intel XMP support for 1st, 2nd and 3rd Generation Intel Core Processors |
| Shipping weight | 0.08 kg |
| Package size | 204 × 132 × 18 mm |
The Ripjaws module is rated for 1.50V operation; the low-profile heat spreader with finned heatsink is designed to keep temperatures in check at that voltage during extended use.
The aluminium heat spreader passively dissipates heat, so the module adds no fan noise and only minimal case-temperature rise during continuous operation.
Compatibility is listed for Intel LGA1155 and LGA1156 platforms as well as AMD AM3, AM3+ and Llano sockets.
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