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Two white DDR5 memory modules with black brushed-aluminum strips and RGB light bars

G.SKILL

G.SKILL F5-6400J3039G16GX2-TZ5RW 32GB (2 x 16GB) DDR5 6400 CL30 desktop RAM

SKU CH-KGVC-DF411 MPN F5-6400J3039G16GX2-TZ5RW

Dual-channel 32 GB DDR5 kit running at 6400 MT/s with CL30 timings and white RGB heatspreaders

  • Capacity32GB (2 x 16GB)
  • Type288-Pin PC RAM
  • SpeedDDR5 6400 (PC5 51200)
  • CAS LatencyCL30
  • Timing30-39-39-102
  • Voltage1.40V

Capacity 32GB (2 x 16GB)

Speed DDR5 6400 (PC5 51200)

CAS Latency|Color|LED Color CL30|White|RGB

  • Dual-channel 32 GB kit enables high-bandwidth multitasking
  • DDR5 6400 speed delivers ultra-fast data transfer rates
  • CL30 30-39-39-102 timings provide low-latency responsiveness
  • Intel XMP 3.0 profile allows one-click overclocking setup
  • Matte-white aluminium heatspreader with RGB bar ensures cool stylish operation

Trident Z5 RGB DDR5 6400 CL30 kit

This 32GB dual-channel kit uses two 16GB modules rated at DDR5 6400 with CL30 30-39-39-102 timings. Hand-screened ICs and Intel XMP 3.0 profiles target high-performance gaming and enthusiast builds on compatible platforms.

1.40V operation and aluminium heatspreader

The white matte heatspreader with a brushed-aluminium strip dissipates heat from the DRAM at the rated 1.40V. No active cooling is included, so airflow inside the case manages thermals and keeps noise dependent on system fans.

Addressable RGB light bar and XMP 3.0

A translucent RGB bar runs the length of each module for customisable lighting effects. The Intel XMP 3.0 profile stores the 6400 speed and CL30 timings, allowing one-click configuration without manual timing entry.

Highlights

  • Dual-channel 32 GB kit enables high-bandwidth multitasking
  • DDR5 6400 speed delivers ultra-fast data transfer rates
  • CL30 30-39-39-102 timings provide low-latency responsiveness
  • Intel XMP 3.0 profile allows one-click overclocking setup
  • Matte-white aluminium heatspreader with RGB bar ensures cool stylish operation

Specifications

BrandG.SKILL
SeriesTrident Z5 RGB Series
ModelF5-6400J3039G16GX2-TZ5RKW
Capacity32GB (2 x 16GB)
Type288-Pin PC RAM
SpeedDDR5 6400 (PC5 51200)
CAS LatencyCL30
Timing30-39-39-102
Voltage1.40V
Multi-channel KitDual Channel Kit
BIOS/Performance ProfileIntel XMP 3.0
ColorWhite
Heat SpreaderYes
FeaturesExtreme performance DDR5 memory designed for gaming and PC enthusiasts
Customizable RGB lighting support
Intel XMP 3.0 Support
Do not mix memory kits. Memory kits are sold in matched kits that are designed to run together as a set. Mixing memory kits will result in stability issues or system failure.
Memory kits will boot at the SPD speed at default BIOS settings with compatible hardware.
For memory kits with XMP, enable XMP profile in BIOS to reach the rated potential XMP overclock speed of the memory kit, subject to the use of compatible hardware.
Reaching the rated XMP overclock s
Recommend UseHigh Performance or Gaming Memory / Intel 600 Series / Intel 700 Series / Intel B560 / Intel B660 / Intel B670 / Intel B760 / Intel Compatible / Intel Z590 / Intel Z690 / Intel Z790
LED ColorRGB
Shipping weight0.11 kg
Package size160 × 132 × 10 mm

Other versions of this model

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Questions about this item

How do I install the 288-pin DDR5 modules and enable the Intel XMP 3.0 profile?

Align the notch on each 288-pin DDR5 module with the slot key, press firmly until the retention clips click, then enter the BIOS and select the Intel XMP 3.0 profile to apply the 6400 MT/s speed and CL30-39-39-102 timings at 1.40 V.

What maintenance or replacement will the RGB heatspreader and memory ICs need over time?

The aluminum heatspreader and RGB light bar require only occasional dust removal with compressed air; the hand-screened DDR5 ICs have no user-serviceable parts and are rated for continuous operation at the specified voltage and timings.

What limit appears first during sustained loads — thermal throttling or voltage stability?

The kit is validated to run at 1.40 V with CL30-39-39-102 timings; the dual-texture heatspreader is designed to keep the ICs within spec, so voltage stability at the XMP 3.0 profile is the limiting factor before thermal throttling occurs.

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