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GELID SOLUTIONS

GELID SOLUTIONS HeatPhase Ultra AMD 40x40x0.2mm 8.5W/mk thermal pad

SKU CH-GMPW-G38KQ

A 40 x 40 x 0.2 mm thermal pad rated at 8.5 W/mk for AMD CPUs, non-electrically conductive and non-curing

  • Effortless install and removal saves build time
  • 5 W/mk conductivity moves heat fast from the CPU
  • Non-curing formula keeps performance steady for years
  • Non-conductive material removes short-circuit risk
  • No-bleed design stays put for a clean application

AMD-Specific Thermal Pad

This thermal pad is cut to 40x40 mm for AMD processor heat spreaders and arrives in new condition. It serves builders who need a non-conductive interface material that will not bleed or cure over time. The compound targets DIY assemblers and service technicians working on AMD desktop CPUs. It is not suited for larger server heat spreaders or for GPUs requiring thicker gap fillers.

8.5 W/mK Conductivity Rating

The single specification that determines fit is the rated thermal conductivity of 8.5 W/mK. This value places the pad in the high-performance tier for thin interface materials and directly governs how much heat it can move from the die to the cooler. Buyers should match this figure against their cooler's mounting pressure and the CPU's thermal design power. Lower-conductivity pads will not deliver equivalent temperature drops.

0.2 mm Thickness, No-Cure Formula

At 0.2 mm thick the pad conforms quickly under normal socket pressure and requires no spreading tools. Because it does not cure or harden, removal during later upgrades is clean and residue-free. The non-electrically-conductive composition prevents short circuits if the pad contacts surface-mount components. Over-tightening the cooler can still pump the material out, so follow the cooler manufacturer's torque guidance.

Highlights

  • Effortless install and removal saves build time
  • 5 W/mk conductivity moves heat fast from the CPU
  • Non-curing formula keeps performance steady for years
  • Non-conductive material removes short-circuit risk
  • No-bleed design stays put for a clean application

Specifications

No published specifications for this item yet.

Questions about this item

What does 8.5 W/m·K mean once the pad is installed on an AMD CPU?

The 8.5 W/m·K rating indicates high thermal conductivity, so heat moves quickly from the CPU die through the 0.2 mm pad into the cooler for lower operating temperatures.

How does the non-electrically conductive property affect use on a CPU?

Because the pad does not conduct electricity, it eliminates short-circuit risk if it contacts nearby components or traces on the processor package.

Will the 40 mm by 40 mm size cover the heat spreader on my AMD processor?

The 40×40 mm pad matches the dimensions specified for compatible AMD sockets, covering the integrated heat spreader without overhang.

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