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E-ATX board, dark metal armour, four DDR5 slots, twin 10GbE ports, Thunderbolt 4 headers, WIFI7 antenna connectors

GIGABYTE

GIGABYTE Z890 AORUS MASTER AI TOP Intel motherboard

SKU CH-H58S-82B0Q MPN Z890 AORUS MASTER AI TOP

E-ATX board for Intel Core Ultra Series 2 on LGA 1851 with four DDR5 slots up to 256 GB, PCIe 5.0 x16, four M.2 sockets, dual Thunderbolt 4, WIFI7 and dual 10 GbE LAN

  • CPU Socket TypeLGA 1851
  • CPU TypeIntel Core Ultra Processors (Series 2)
  • ChipsetIntel Z890 Express
  • Number of Memory Slots4x288pin (DDR5)
  • Memory StandardDDR5 5600 / DDR5 5800 / DDR5 6000 / DDR5 6200 / DDR5 6400 /
  • Maximum Memory Supported256GB
  • Supports Intel Core Ultra Series 2 processors via LGA 1851 socket
  • Four DDR5 DIMM slots reach 256 GB with XMP 3.0 profiles
  • 20+1+2 phase VRM with 110 A smart power stages for stable delivery
  • Four M.2 slots including PCIe 5.0 and 4.0 options for fast storage
  • Dual 10 GbE LAN plus WIFI7 for high-speed networking

LGA 1851 platform for Intel Core Ultra Series 2

This motherboard targets enthusiasts building high-end workstations or gaming rigs around Intel Core Ultra processors. The Z890 chipset unlocks overclocking headroom for both CPU and memory. Four DDR5 slots support up to 256 GB total capacity with XMP 3.0 profiles.

EZ-Latch hardware simplifies storage and GPU swaps

Tool-free M.2 EZ-Latch clips secure up to four SSDs without screws while PCIe EZ-Latch releases graphics cards with one finger. Dual Thunderbolt 4 ports add 40 Gbps external bandwidth for docks or storage arrays. Front-panel USB-C header connects modern cases directly.

PCIe 5.0 lane allocation shapes expansion choices

The CPU provides one x16 slot at PCIe 5.0 and one M.2 at PCIe 5.0 x4; a second CPU-attached M.2 runs at PCIe 4.0 x4. Two chipset M.2 slots and a PCIe 4.0 x4 slot share downstream bandwidth. Four SATA 6 Gbps ports and dual 10 GbE LAN complete the I/O map.

Highlights

  • Supports Intel Core Ultra Series 2 processors via LGA 1851 socket
  • Four DDR5 DIMM slots reach 256 GB with XMP 3.0 profiles
  • 20+1+2 phase VRM with 110 A smart power stages for stable delivery
  • Four M.2 slots including PCIe 5.0 and 4.0 options for fast storage
  • Dual 10 GbE LAN plus WIFI7 for high-speed networking

Specifications

BrandGIGABYTE
ModelZ890 AORUS MASTER AI TOP
CPU Socket TypeLGA 1851
CPU TypeIntel Core Ultra Processors (Series 2)
ChipsetIntel Z890 Express
Number of Memory Slots4x288pin (DDR5)
Memory StandardDDR5 5600 / DDR5 5800 / DDR5 6000 / DDR5 6200 / DDR5 6400 / DDR5 6600 / DDR5 6800 / DDR5 7000 / DDR5 7200 / DDR5 7400 / DDR5 7600 / DDR5 7800 / DDR5 7900 / DDR5 7950 / DDR5 8000 / DDR5 8200 / DDR5 8266 / DDR5 8400 / DDR5 8600 / DDR5 8800 / DDR5 8933 / DDR5 9066 / DDR5 9200 / DDR5 9333 / DDR5 9466 / DDR5 9500
Maximum Memory Supported256GB
Channel SupportedDual Channel
Memory Performance ProfileIntel XMP 3.0
Memory Feature4 x DDR5 DIMM sockets supporting up to 256 GB (64 GB single DIMM capacity)of system memory
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
Support CUDIMM memory module
PCI Express 5.0 x16CPU:
- 1 x PCI Express x16 slot, supporting PCIe 5.0 and running at x16 (PCIEX16)
* The PCIEX16 slot can only support a graphics card or an NVMe SSD. If only one graphics card is to be installed, be sure to install it in the PCIEX16 slot.
* The PCIEX8 slot shares bandwidth with the PCIEX16 slot. When the PCIEX8 slot is populated, the PCIEX16 slot operates at up to x8 mode.
- 1 x PCI Express x16 slot, supporting PCIe 5.0 and running at x8 (PCIEX8)
PCI Express 4.0 x16Chipset:
- 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x4 (PCIEX4)
Serial ATA (SATA)4 x SATA 6Gb/s
M.2CPU:
- 1 x M.2 connector (Socket 3, M key, type 25110/22110/2580/2280 PCIe 5.0 x4/x2 SSD support) (M2A_CPU)
- 1 x M.2 connector (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2B_CPU)
Chipset:
- 1 x M.2 connector (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2Q_SB)
- 1 x M.2 connector (Socket 3, M key, type 22110/2280 SATA and PCIe 4.0 x4/x2 SSD support) (M2M_SB)
SATA RAIDRAID 0, RAID 1, RAID 5, and RAID 10 support for NVMe SSD storage devices
RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices
Audio ChipsetESS ES9280 chip (rear panel audio)
- Support for DTS:X Ultra
- High Definition Audio
- 2-channel
ESS ES9118 DAC chip (front panel audio)
LAN Chipset2 x Marvell AQtion AQC113C 10GbE LAN chips
Max LAN Speed2 x 10Gbps
Wireless LANWi-Fi 802.11 be
BluetoothBLUETOOTH 5.4
Back I/O Ports1 x Q-Flash Plus button
1 x OC Ignition button
2 x Intel Thunderbolt 5 connectors (USB Type-C ports)
10 x USB 3.2 Gen 2 Type-A ports (red)
2 x RJ-45 ports
2 x antenna connectors (2T2R)
2 x audio jacks
1 x optical S/PDIF Out connector
Onboard USB1 x USB Type-C header, with USB 3.2 Gen 2x2 support
2 x USB 3.2 Gen 1 headers
2 x USB 2.0/1.1 headers
Other Connectors1 x CPU fan header
1 x CPU fan/water cooling pump header
4 x system fan headers
4 x system fan/water cooling pump headers
4 x addressable RGB Gen2 LED strip headers
1 x RGB LED strip header
4 x M.2 Socket 3 connectors
4 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x noise detection header
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0/GC-TPM2.0 SPI V2 module only)
1 x HDMI port (Note)
1 x power button
1 x reset button
1 x reset jumper
1 x Clear CMOS jumper
2 x temperature sensor headers
Voltage Measurement Points
(Note) Ac
BIOS Feature1 x 256 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Windows 11Windows 11 64-bit
Form FactorExtended ATX
Dimensions (W x L)12.0" x 11.2"
Power Pin1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors
FeaturesSupport for GIGABYTE Control Center (GCC)
Support for Q-Flash
Support for Q-Flash Plus
Support for Smart Backup
Shipping weight3.79 kg
Package size377 × 330 × 95 mm

Questions about this item

Will the 20+1+2 phase VRM with 110A power stages need active cooling or replacement under long-term heavy loads?

The VRM Thermal Armor Advanced heatsink covers the 20+1+2 phase design with 110A smart power stages and is built for sustained operation without scheduled replacement.

Which thermal limit appears first when all four M.2 slots run PCIe 5.0 or 4.0 drives continuously?

M.2 Thermal Guard heatsinks cover the CPU and chipset M.2 connectors to manage drive temperatures during sustained PCIe 5.0 and 4.0 workloads.

How loud are the chipset and VRM fans when the board runs 10GbE LAN, Wi-Fi 7 and Thunderbolt 4 all day?

The board uses passive VRM Thermal Armor Advanced and M.2 Thermal Guard cooling with no chipset fan, so sustained 10GbE, Wi-Fi 7 and Thunderbolt 4 traffic adds no fan noise.

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