ASUS TM420IA-DB71T 2-in-1 laptop 14" FHD touch AMD Ryzen 7 4700U 8GB 512GB
- Bespoke Black
- Convertible
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HP
A 14-inch 3K OLED touch convertible with Intel Core Ultra X7 358H, 32 GB LPDDR5x, Arc B390 graphics, Wi-Fi 7 and a 68 Whr battery
The HP EliteBook X Flip G2i is a 14-inch 2-in-1 Windows 11 Pro laptop built for mobile professionals who need touch and pen input in a lightweight chassis. Its 3K OLED touchscreen runs at 120 Hz with 500 nits brightness and covers 100% DCI-P3 for colour-critical work.
This device suits executives and creatives who want an Intel Core Ultra X7 processor with 32 GB LPDDR5x memory, integrated Arc graphics, Wi-Fi 7 and Poly-tuned quad speakers for collaboration on the move. Buyers who need discrete GPU power for heavy 3D rendering, expandable memory slots or a larger screen should consider other form factors.
The soldered 32 GB LPDDR5x-9600 MT/s memory is the single specification that decides fit because it cannot be upgraded after purchase; confirm the capacity meets your workload before ordering.
| Brand | HP |
|---|---|
| Part Number | D4VJ0UA#ABA |
| Operating System | Windows 11 Pro |
| CPU Type | Intel Core Ultra X7 |
| Screen Size | 14.0" |
| GPU/VPU | Intel Arc B390 GPU |
| Graphic Type | Integrated Card |
| WLAN | Intel® Wi-Fi 7 BE211 (2x2) and Bluetooth® 6 wireless card, non-vPro® |
| Bluetooth | Bluetooth® 6.0 |
| Audio Ports | Audio by Poly Studio, quad stereo speakers, dual microphones enhanced by AI noise reduction |
| Type | Work / Business |
| Battery | Lithium Polymer |
| Battery Life | 68Whr |
| Dimensions (W x D x H) | 12.31 x 8.66 x 0.31 in (minimum front); 12.31 x 8.66 x 0.52 in (minimum rear); 12.31 x 8.66 x 0.36 in (maximum front); 12.31 x 8.66 x 0.57 in (maximum rear) |
| Weight | 2.8600 lb |
The memory is soldered to the mainboard and cannot be upgraded or replaced by the user; the common mistake is trying to open the chassis to add modules.
The battery is internal and not user-replaceable; when capacity degrades, service by an authorised technician is required.
Thermal throttling will engage once the cooling system reaches its capacity, reducing clock speeds to protect the silicon.
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