ARCTIC COOLING ACTCP00007B MX-4 2019 Edition thermal paste 2.0g
- 2.0g
- 8.5 W/mK
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Intel
Passive 25.5 mm aluminium heatsink rated for 95 W Xeon 5500 series CPUs, weighing 1.2 kg
The Intel BXSTS100P is a passive heatsink rated for 95 W TDP processors. It targets system integrators building 1U or 2U rack and blade servers where ducted chassis airflow replaces a fan. The 1.2 kg aluminium construction keeps weight low for dense deployments.
The 25.5 mm profile matches the tight vertical clearance of 1U and 2U enclosures. Mounting holes align with Intel Xeon 5500 series retention brackets so the heatsink seats directly on the processor without a separate backplate. No fan header or power cable is required because the design relies entirely on chassis ducting.
Thermal performance assumes forced air moving through the chassis duct at vendor-specified velocity; without that airflow the 95 W rating cannot be sustained. The heatsink is not compatible with previous-generation server platforms or workstation boards lacking the correct mounting pattern. Buyers needing active cooling or broader socket support must choose a different solution.
| Brand | Intel |
|---|---|
| Model | BXSTS100P |
| Type | Heatsinks only |
| Weight | 1.2 |
| Features | Maximum CPU TDP: 95W 1U or 2U rack and blade chassis with ducted airflow to heat sink |
| Shipping weight | 0.91 kg |
| Package size | 152 × 152 × 152 mm |
The heatsink is rated for a maximum CPU TDP of 95W, so it can cool processors up to that thermal limit without active airflow.
At 25.5mm tall, the cooler fits 1U or 2U rack and blade chassis that provide ducted airflow directly over the heatsink fins.
It uses the standard Intel retention mechanism for the 5500 series; the common mistake is omitting the supplied thermal interface material or reusing old paste.
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