NEMIX RAM 64GB DDR4 3200 4Rx4 1.2V 288-PIN ECC LRDIMM server RAM
- DDR4 3200 (PC4 2560…
- 22
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Intel
32-core server CPU with 3.1 GHz base clock, 4.0 GHz max turbo, 60 MB L3 cache and DDR5-4800 support
The Intel Xeon Gold 6458Q is a 32-core, 64-thread server processor built on 10 nm Sapphire Rapids architecture. It targets dual-socket platforms that need high core counts and large memory capacity for virtualisation, database and compute workloads. The LGA 4677 socket and 2S scalability define its deployment scope.
Thermal design power is rated at 350 W, so substantial cooling capacity is required for sustained operation. Base frequency runs at 3.1 GHz with a maximum turbo frequency of 4.0 GHz across the 32 cores. Power draw and acoustic output will scale with the cooling solution chosen by the system integrator.
The processor drops into an LGA 4677 socket and provides 80 lanes of PCI Express 5.0 for high-speed storage, networking and accelerator cards. Eight-channel DDR5 4800 memory support enables up to 4 TB of system memory per socket. No cooling device is included in the package.
| Brand | Intel |
|---|---|
| Series | Intel Xeon Gold |
| Name | Xeon Gold 6458Q |
| Model | PK8071305121501 |
| CPU Socket Type | LGA 4677 |
| Core Name | Sapphire Rapids |
| # of Cores | 32-Core |
| # of Threads | 64 |
| Operating Frequency | 3.1 GHz |
| Max Turbo Frequency | 4.0 GHz |
| L3 Cache | 60MB |
| 64-Bit Support | Yes |
| Manufacturing Tech | 10 nm |
| Integrated Memory Controller Speed | DDR5 4800 |
| Maximum Memory Capacity | 4TB |
| Memory Channel | 8 Channel |
| Virtualization Technology Support | Yes |
| Scalability | 2S |
| PCI Express Revision | 5.0 |
| Max # of PCI Express Lanes | 80 |
| Multimedia Instruction | Intel AMX, Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 |
| Thermal Design Power | 350W |
| Cooling Device | Cooling device not included - Processor Only |
| Shipping weight | 0.23 kg |
| Package size | 127 × 102 × 13 mm |
Align the processor triangle marker with the socket corner, lower it straight down without forcing, then secure the carrier lever; the LGA 4677 socket has fragile pins on the motherboard side, so never press the chip after it seats.
Replace thermal paste every two to three years and clean heatsink fins quarterly; the 350 W thermal design power demands a server-grade cooler rated for at least that TDP, and dust buildup reduces heat dissipation quickly.
The 350 W thermal design power is the first ceiling; under continuous AVX-512 the processor will throttle to stay within that envelope, so ensure your cooling solution can sustain 350 W heat removal indefinitely.
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