NEMIX RAM 64GB DDR4 3200 4Rx4 1.2V 288-PIN ECC LRDIMM server RAM
- DDR4 3200 (PC4 2560…
- 22
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Intel
16-core server processor with 32 threads, 2.3 GHz base clock, 3.90 GHz max turbo, 22MB L3 cache, six memory channels at 2667 MHz, 48 PCIe 3.0 lanes and 125W TDP
The Intel Xeon Gold 5218 is a 16-core server processor built for data-centre and hybrid-cloud workloads. It delivers 32 threads through Hyper-Threading support and runs on the LGA 3647 platform using 14 nm Cascade Lake architecture.
The operating frequency sits at 2.3 GHz and can reach a maximum turbo frequency of 3.90 GHz, defining the compute throughput available for demanding applications. This clock range, combined with 22 MB of L3 cache, determines whether the chip matches a specific performance envelope.
An integrated memory controller supports six channels at 2667 MHz, while the processor exposes up to 48 PCI Express 3.0 lanes for high-bandwidth I/O. The 125 W thermal design power sets the cooling requirement, and the LGA 3647 socket dictates the motherboard platform needed for deployment.
| Brand | Intel |
|---|---|
| Series | Intel Xeon Gold |
| Name | Xeon Gold 5218 |
| Model | BX806955218 |
| CPU Socket Type | LGA 3647 |
| Core Name | Cascade Lake |
| # of Cores | 16-Core |
| # of Threads | 32 |
| Operating Frequency | 2.3 GHz |
| Max Turbo Frequency | 3.90 GHz |
| L3 Cache | 22MB |
| 64-Bit Support | Yes |
| Hyper-Threading Support | Yes |
| Manufacturing Tech | 14 nm |
| Integrated Memory Controller Speed | 2667 MHz |
| Memory Channel | 6 Channel |
| Virtualization Technology Support | Yes |
| PCI Express Revision | 3.0 |
| Max # of PCI Express Lanes | 48 |
| Thermal Design Power | 125W |
| Shipping weight | 0.19 kg |
| Package size | 137 × 114 × 46 mm |
The processor runs at 2.3 GHz on all 16 cores under sustained load, giving predictable throughput for database or virtualization tasks without relying on turbo behaviour.
PCIe 3.0 with 48 lanes provides high-bandwidth connectivity for multiple add-in cards such as storage controllers or network adapters in a dual-socket server board.
The LGA 3647 socket uses a narrow ILM retention mechanism and needs a heatsink rated for 125 W TDP with the matching mounting pattern for 1U or 2U server chassis.
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