Micron Technology, Inc. MT4JTF12864AZ-1G4D1 1GB DDR3 1333 Desktop RAM
- 1GB
- DDR3 1333 (PC3 1060…
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KINGBANK
16 GB dual-channel DDR5 kit running at 6000 MT/s with CL36 timing and a silver alloy heatsink
This 16GB kit contains two 8GB DDR5 modules rated at 6000MHz with CL36 timings. It targets desktop builders who want a straightforward memory upgrade for gaming or productivity without manual tuning. The silver alloy heatsink and on-die ECC add reliability for sustained workloads.
The modules support both Intel XMP 3.0 and AMD EXPO profiles, so the rated speed activates through the motherboard BIOS on compatible platforms. They are unbuffered 288-pin DIMMs that operate at 1.35V. The supplier notes that populating all four slots on some 12th-generation Intel boards may reduce frequency, so a two-slot configuration in slots 2 and 4 is advised.
The 16GB total capacity handles mainstream gaming, content creation and multitasking comfortably. On-die ECC provides internal error correction for data integrity. Builders planning heavy virtualisation, large-scale rendering or memory-intensive server tasks will need higher-capacity kits beyond this 16GB limit.
| Capacity | 16GB (2 x 8GB) |
|---|---|
| Type | 288-Pin PC RAM |
| Speed | DDR5 6000 (PC5 48000) |
| CAS Latency | CL36 |
| Timing | 36-36-36-80 |
| ECC | ON-die ECC |
| Buffered/Registered | Unbuffered |
| BIOS/Performance Profile | Intel XMP 3.0 and AMD EXPO |
| Color | Silver |
| Heat Spreader | Yes |
| Features | XMP 3.0 /EXPO Superior Chip Quality Enhanced Heat Dissipation |
| Recommend Use | AMD & Intel Compatible |
The kit runs at CL36 with timings of 36-36-36-80, which remain stable during extended use thanks to on-die ECC and SK Hynix chips.
The 2mm-thick alloy heat spreader conducts heat efficiently without any moving parts, so the modules stay cool and completely silent even under continuous load.
Your motherboard needs an Intel XMP 3.0 or AMD EXPO profile in its BIOS, and the modules should be installed in slots 2 and 4 for best stability.
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