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White tub containing thermal grease with spreading spoon and decal

Kingpin Cooling KPX-30G-002 thermal grease 30g

SKU CH-2NVF-78JPX MPN KPX-30G-002

Non-conductive thermal grease for CPU and GPU overclocking, supplied in a 30g tub with spreading spoon

  • TypeCPU Block
  • Non-conductive formula protects components during application
  • Low thermal resistance enables efficient heat transfer for overclocking
  • Validated for CPU and GPU use from air to liquid nitrogen cooling
  • 30g tub provides enough compound for multiple installations
  • Includes spreading spoon for precise, even application

High-Performance Thermal Grease

KPx thermal grease is a non-conductive compound designed for CPU and GPU overclocking. The 30 gram tub includes a spreading spoon and a KPC decal. It is validated for use from standard air and water cooling down to extreme sub-zero methods.

Practical Limits of Thermal Interface

The compound bridges microscopic gaps between the die and the cold plate to lower thermal resistance. It remains non-conductive, eliminating the risk of short circuits if excess material spreads near components. Performance scales with mounting pressure and surface flatness rather than the grease alone.

Installation Notes and Common Issues

Application is straightforward using the included spoon to place a small amount before spreading evenly. The most frequent error is applying too much paste, which can pump out under pressure and create a mess. Ensure surfaces are clean and free of old residue for optimal contact.

Highlights

  • Non-conductive formula protects components during application
  • Low thermal resistance enables efficient heat transfer for overclocking
  • Validated for CPU and GPU use from air to liquid nitrogen cooling
  • 30g tub provides enough compound for multiple installations
  • Includes spreading spoon for precise, even application

Specifications

TypeCPU Block

Questions about this item

Is the 30g tub the only size available for this KPX thermal grease?

The product is supplied as a single 30g tub containing the non-conductive compound.

How does the low-resistance formula perform once applied between a CPU and cooler?

It is designed and validated for overclocking scenarios from air and water cooling down to extreme sub-zero temperatures.

What mounting interface does the included CPU block use and what does that limit?

The block is a CPU-type water-block; its mounting pattern determines which sockets it can fit.

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