KLEVV KD58GU880-60A300L 16GB DDR5 6000 CL30 desktop RAM
- 16GB (2 x 8GB)
- DDR5 6000 (PC5 4800…
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KLEVV
16 GB dual-channel DDR5 kit at 6000 MT/s with CL30 timing and 1.35 V for high-performance desktop builds
Capacity
Struck-through versions exist but are not stocked here.
Speed DDR5 6000
Color Gray C30
Struck-through versions exist but are not stocked here.
This 16GB dual-channel kit delivers DDR5 6000 speed with CL30 latency for desktop builders targeting AMD Ryzen and Intel platforms. White aluminum heatsinks keep the profile low so large air coolers fit without interference.
On-die ECC and a dedicated PMIC maintain data integrity and stable voltage during long rendering or compilation sessions. The 1.35V operating point and 30-36-36-76 timings are designed to hold rated frequency without thermal throttling.
Silver heatsinks use selected ICs without mixing memory IDM to ensure consistent quality across both modules. Intel XMP 3.0 and AMD EXPO profiles load automatically in BIOS for immediate operation at rated speed.
| Brand | Klevv |
|---|---|
| Model | KD58GU880-60A300F |
| Capacity | 16GB (2 x 8GB) |
| Speed | DDR5 6000 (PC5 48000) |
| CAS Latency | CL30 |
| Timing | 30-36-36-76 |
| Voltage | 1.35V |
| Multi-channel Kit | Dual Channel Kit |
| BIOS/Performance Profile | AMD EXPO / Intel XMP 3.0 / Intel XMP 3.0 and AMD EXPO |
| Color | White |
| Recommend Use | AMD & Intel Compatible / AMD 500 Series / AMD 600 Series / AMD 800 Series / AMD A520 / AMD B550 / AMD B650 / AMD B850 / AMD Ryzen Compatible / AMD WRX90 / AMD X570 / AMD X670 / AMD X870 / High Performance or Gaming Memory / Intel 500 Series / Intel 600 Series / Intel 700 Series / Intel 800 Series / Intel B560 / Intel B660 / Intel B670 / Intel B760 / Intel Compatible / Intel H770 / Intel Z590 / Intel Z690 / Intel Z790 / Intel Z890 |
| LED Color | None |
| Shipping weight | 0.09 kg |
| Package size | 191 × 146 × 6 mm |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
The modules operate at 1.35 V with on-die ECC and a PMIC for efficient power delivery, while silver aluminum heatsinks provide maximum cooling during sustained workloads.
The kit needs a DDR5 DIMM slot and a BIOS that can load Intel XMP 3.0 or AMD EXPO profiles; the motherboard QVL lists this part as approved.
Yes, the ultra-low-profile design clears oversized CPU coolers, and the kit is QVL approved for mainstream DDR5 motherboards including 500, 600 and 800 series chipsets.
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