Micron
Micron MTFDKCC7T6TFR-1BC15ABYYR 7450 PRO enterprise SSD 7.68 TB
U.3 PCIe 4.0 NVMe enterprise SSD with 7.68 TB capacity and 176-layer NAND
- Enterprise workloads accelerate with PCIe 4.0 NVMe speed
- Consistent 2 ms latency at 99.9999% QoS for responsive data centers
- 176-layer NAND delivers 7.68 TB high-capacity storage
- OCP NVMe SSD 2.0 support enables rapid issue resolution
- U.3 22 x 80 mm form factor with power-loss protection for server boot
Capacity & interface
The Micron 7450 PRO enterprise SSD delivers 7.68 TB of storage over a PCIe 4.0 NVMe interface. It uses a U.3 form factor measuring 22 x 80 mm and is built on 176-layer NAND technology. The drive targets cloud-scale and enterprise data centres that need high-capacity, low-latency storage.
Boot & OCP focus
This model is specifically designed for server boot use and includes power-loss protection. It supports OCP NVMe SSD 2.0 for intelligent management and rapid issue resolution. The jump is worthwhile when replacing drives that lack standardised management or consistent quality-of-service guarantees.
Latency headroom
The SSD consistently delivers 2 ms and lower latency for 99.9999% QoS across varied workloads. A unique secure execution environment adds hardware-level protection. It is not suited for buyers who need a different physical connector or a drive without power-loss protection for boot tasks.
Highlights
- Enterprise workloads accelerate with PCIe 4.0 NVMe speed
- Consistent 2 ms latency at 99.9999% QoS for responsive data centers
- 176-layer NAND delivers 7.68 TB high-capacity storage
- OCP NVMe SSD 2.0 support enables rapid issue resolution
- U.3 22 x 80 mm form factor with power-loss protection for server boot
Specifications
No published specifications for this item yet.
Questions about this item
Will the 22 x 80 mm M.2 form factor fit my server's U.3 bay?
The drive uses the M.2 22 x 80 mm footprint with a U.3 PCIe 4.0 NVMe interface; verify your chassis accepts that exact module size before purchase.
What is the most common installation mistake with the U.3 connector?
Inserting the module at an angle instead of straight into the U.3 backplane can bend the PCIe 4.0 signal pins and prevent the drive from being detected.
When should I plan to replace the 176-layer NAND drive?
Track the Media and Data Integrity SMART log; when the percentage-used field reaches the vendor-defined threshold the 7.68 TB unit should be swapped.
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