NEMIX RAM
NEMIX RAM 32GB (2×16GB) DDR4 3200 CL22 260‑pin SODIMM for Dell Latitude 5430 Rugged Extreme
A 32 GB DDR4 SODIMM kit running at 3200 MHz with CL22 latency for Dell Latitude 5430 Rugged Extreme
- Capacity32GB (2 x 16GB)
- SpeedDDR4 3200 (PC4 25600)
- ECCNo
- Buffered/RegisteredUnbuffered
- ChipsetMajor OEM Samsung, Micron, Hynix
- Voltage1.20V
- 32 GB dual-channel kit doubles capacity for Dell Latitude 5430 Rugged Extreme
- DDR4 3200 MT/s (PC4-25600) speed matches system memory bus
- CL22 latency at 1.2 V keeps power draw low
- 260-pin SODIMM form factor fits laptop slots directly
- Samsung, Micron or Hynix DRAM chips validated for stability
Dell Latitude 5430 Rugged Extreme memory kit
This 32 GB kit contains two 16 GB DDR4 3200 SODIMM modules built for the Dell Latitude 5430 Rugged Extreme. It targets IT professionals and field technicians who need reliable capacity expansion for mobile workstations operating in harsh environments. The non-ECC unbuffered design matches the platform's standard memory architecture.
260-pin SODIMM installation notes
The 260-pin form factor fits the laptop's SO-DIMM slots directly without adapters. Installation typically takes minutes by accessing the memory compartment, though the rugged chassis may require additional screws compared to standard models. No heat spreaders are present, so modules sit flush in tight spaces; verify slot orientation before applying pressure.
Sustained load behaviour at CL22
Modules run at 1.20 V with CL22 latency and 1Rx8 organisation using major OEM Samsung, Micron or Hynix chips. All units undergo rigorous stress testing under load before shipping to ensure stability during extended workloads. The unbuffered DDR4 design maintains consistent throughput without throttling during prolonged compute sessions.
Highlights
- 32 GB dual-channel kit doubles capacity for Dell Latitude 5430 Rugged Extreme
- DDR4 3200 MT/s (PC4-25600) speed matches system memory bus
- CL22 latency at 1.2 V keeps power draw low
- 260-pin SODIMM form factor fits laptop slots directly
- Samsung, Micron or Hynix DRAM chips validated for stability
Specifications
| Brand | NEMIX RAM |
|---|---|
| Series | Dell Laptop, AIO All-in-One, Mobile Workstation Compatible Series Memory |
| Model | Dell DDR4 3200MHZ Non-ECC Unbuffered SODIMM |
| Part Number | MS25600-618K2 |
| Capacity | 32GB (2 x 16GB) |
| Speed | DDR4 3200 (PC4 25600) |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Voltage | 1.20V |
| Compatible System | Dell |
| CAS Latency | CL22 |
| Heat Spreader | No |
| Type | 260-Pin DDR4 SODIMM |
| Rank | 1Rx8 |
| Features | DDR4 Non-ECC Unbuffered SODIMM Motherboard Compatible |
| Package Content | 16GB (1X16GB) DDR4 3200MHZ PC4-25600 1Rx8 1.2V CL22 260-PIN Non-ECC Unbuffered SODIMM |
Questions about this item
How can I confirm the 32 GB kit is running at 3200 MT/s and CL22 after installing it in my Latitude 5430 Rugged Extreme?
Open Task Manager or BIOS after boot and verify the memory speed reads 3200 MT/s with CAS latency 22; both modules should show as 16 GB each for 32 GB total.
What exactly ships in the box and is anything else required for installation?
The kit includes two 16 GB 260‑pin DDR4 SODIMM modules; no extra parts or tools are needed for a standard laptop memory slot.
Should I choose the 32 GB (2×16 GB) CL22 kit or a different capacity for the Latitude 5430 Rugged Extreme?
This 32 GB dual‑rank 1Rx8 kit matches the system’s supported DDR4 3200 specification; select it when you need the maximum 32 GB configuration.
Also in this aisle
People compared these
Same shelf, same checkout — eight coins and a 30-minute rate lock.
YourBestChoice
YourBestChoice 34mm ExpressCard to 2 Port USB 3.0 Adapter NEC Chip
$10.99
0.00014102BTC
In stock
SAMSUNG
SAMSUNG M471B5173QH0-YK0 4GB DDR3L PC3-12800 CL11 1.35V 204P SODIMM memory upgrade
$14.99
0.00019235BTC
In stock