NEMIX RAM 256GB (4 x 64GB) DDR4 3200 PC4-25600 CL22 1.2V ECC RDIMM Server Memory
- 256GB (4 x 64GB)
- 288-Pin DDR4 RDIMM
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NEMIX RAM
A 768GB DDR4-2133 ECC LRDIMM kit of twelve 64GB modules at CL15 1.2V for server memory expansion
Capacity 768GB (12 x 64GB)
This 768GB kit contains twelve 64GB modules built for servers and workstations that need maximum memory capacity in a single system. It targets IT professionals who run virtualisation clusters, large databases or memory-intensive analytics workloads.
Error-correcting code detects and corrects single-bit errors to protect data integrity in mission-critical environments. The load-reduced design lowers electrical loading on the memory bus, allowing all twelve modules to operate together at the rated 2133 MT/s without signal degradation.
Modules use the standard 288-pin DDR4 LRDIMM connector and operate at 1.20V with CL15 latency. The lack of heat spreaders means clearance is minimal, fitting dense server chassis, while the 4Rx4 organisation requires a motherboard qualified for quad-rank load-reduced DIMMs.
| Brand | NEMIX RAM |
|---|---|
| Series | NEMIX RAM Original Series Memory |
| Model | DDR4 ECC LRDIMM Load Reduced Memory |
| Part Number | ML17000-944K12 |
| Capacity | 768GB (12 x 64GB) |
| Type | 288-Pin DDR4 LRDIMM |
| Speed | DDR4 2133 (PC4 17000) |
| CAS Latency | CL15 |
| Voltage | 1.20V |
| ECC | Yes |
| Buffered/Registered | Load Reduced |
| Rank | 4Rx4 |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Heat Spreader | No |
| Features | DDR4 ECC LRDIMM Load Reduced Server Motherboard Compatible |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
No firmware updates are required for the DDR4 2133 CL15 modules; they are validated once at install and run for the system lifetime.
The memory controller's maximum supported capacity or rank count is reached before the 1.20V LRDIMMs hit a thermal or bandwidth ceiling.
The bare 1.2V LRDIMMs have no heat spreaders and no moving parts, so they add only passive DRAM heat handled by the chassis airflow.
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