OWC 8GB DDR4 2933MHz CL21 ECC SODIMM laptop RAM
- 8GB
- 260-Pin DDR4 SO-DIMM
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OWC
A 16 GB dual-channel DDR4 3200 MHz CL22 SODIMM kit for laptops, all-in-ones and NAS systems
Capacity 16GB (2 x 8GB)
This dual-channel kit provides 16 GB of DDR4 memory in two 8 GB modules. It targets owners of compatible laptops, all-in-one PCs and NAS devices who need more capacity for multitasking. The modules follow the standard 260-pin SO-DIMM form factor. Builders requiring registered or ECC memory cannot use this kit.
Each module runs at 1.2 V with a CAS latency of CL22 at 3200 MHz. The unbuffered design draws minimal power and produces no audible noise because there are no moving parts. Heat spreaders are not fitted, so airflow in the chassis handles dissipation. Systems limited to lower voltages or higher latencies may not gain the rated speed.
The memory arrives as a matched pair tested to JEDEC and RoHS standards, removing the need for manual pairing. Installation is a straightforward DIY step in most supported devices. OWC backs the modules with a limited lifetime warranty that includes free technical support and an advanced replacement programme. No additional software or accessories are bundled.
| Brand | OWC |
|---|---|
| Part Number | 3S2D41R8016P |
| Capacity | 16GB (2 x 8GB) |
| Type | 260-Pin DDR4 SO-DIMM |
| CAS Latency | CL22 |
| Voltage | 1.2V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Multi-channel Kit | Dual Channel Kit |
| Heat Spreader | No |
| Recommend Use | Laptops, All-in-One Systems, and NAS Systems |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
Power off the laptop, open the memory compartment, align each module's notch with the slot key, press firmly until the side clips click, then verify 16 GB appears in BIOS or system information.
No scheduled maintenance is required; the non-ECC unbuffered modules run at 1.2 V and are rated for continuous operation, so replacement is only needed if a fault develops.
The CL22 latency at 3200 MHz sets the access-speed ceiling, so memory-bound tasks hit latency limits before bandwidth or thermal constraints become factors.
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