OWC 32GB (4x8GB) DDR3 1333 ECC Registered RDIMM Dell Precision T5500
- 32GB (4 x 8GB)
- 240-Pin DDR3 ECC RD…
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OWC
32 GB registered ECC DDR3 kit (four 8 GB modules) at 1333 MHz for Lenovo System x3550 M3 R4 and x3650 M2 servers
Capacity 32GB (4 x 8GB)
This 32GB kit contains four 8GB DDR3 1333 registered ECC modules built for Lenovo System x3550 M3 R4 and x3650 M2 servers. The 240-pin RDIMMs run at 1.5V with CL9 latency and a 2Rx4 organisation. They are designed for workloads that require error-correcting registered memory in compatible enterprise platforms.
Registered buffering and ECC functionality mean these modules only work in systems that explicitly support registered ECC DDR3. They cannot be mixed with unbuffered memory and will not function in standard desktop or consumer workstation boards. The kit replaces a range of Lenovo part numbers including 0A89412, 46C0542 and 46C7449.
The single specification that decides fitment is DDR3 1333 registered ECC RDIMM in a 240-pin form factor. If the target server calls for unbuffered, non-ECC or a different DDR generation, this kit will not install or operate. Verify the platform requires registered ECC DDR3 before purchase.
| Brand | OWC |
|---|---|
| Part Number | 1R3D32R4032S |
| Capacity | 32GB (4 x 8GB) |
| Type | 240-Pin DDR3 ECC RDIMM |
| Speed | DDR3 1333 (PC3 10600) |
| CAS Latency | CL9 |
| Voltage | 1.5V |
| ECC | Yes |
| Buffered/Registered | Registered |
| Rank | 2Rx4 |
| Heat Spreader | No |
| Compatible System | Lenovo System x3550 M3 R4 Lenovo System x3650 M2 |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
The modules are JEDEC-compliant DDR3 1333 registered ECC DIMMs. Install them in matched sets of four; no firmware update is required beyond the server’s normal BIOS.
The kit is rated DDR3 1333 (PC3-10600) CL9 at 1.5 V, so the memory bus itself is the first bottleneck under sustained throughput.
Each 8 GB 2Rx4 module draws standard DDR3 1.5 V power with no heat spreader; total draw stays within the platform’s normal DIMM thermal envelope.
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