OWC 32GB DDR5 4800 CL40 ECC Registered RDIMM for Dell PowerEdge XE9680
- 32GB
- 288-Pin DDR5 ECC RD…
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OWC
32 GB DDR5-4800 ECC registered RDIMM with CL40 latency and 1.1 V operation, validated for Lenovo ThinkSystem SR950 V3 servers
This 32GB DDR5 4800 registered DIMM is built for the Lenovo ThinkSystem SR950 V3 server. It delivers ECC error correction and registered buffering required by enterprise workloads. The module runs at 1.1V with CL40 latency and a 1Rx4 organisation. It replaces Lenovo part numbers 4X77A77030 4X77A77483 4X77A81438 4X77A81439.
The module is registered ECC and cannot be mixed with unbuffered or load-reduced DIMMs in the same system. It carries no heat spreader and conforms to JEDEC and RoHS standards. OWC provides a limited lifetime warranty with free technical support and an advanced replacement programme. These services are supplied by the memory manufacturer not by the server vendor.
Before ordering confirm the SR950 V3 has free 288-pin DDR5 slots and check the server documentation for maximum capacity per channel and supported population order. The module is not compatible with standard desktop motherboards or any system that requires unbuffered or load-reduced memory.
| Brand | OWC |
|---|---|
| Part Number | 4R8D51R432GB |
| Capacity | 32GB |
| Type | 288-Pin DDR5 ECC RDIMM |
| Speed | DDR5 4800 (PC5 38400) |
| CAS Latency | CL40 |
| Voltage | 1.1V |
| ECC | Yes |
| Buffered/Registered | Registered |
| Rank | 1Rx4 |
| Heat Spreader | No |
| Compatible System | Lenovo ThinkSystem SR950 V3 |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
ECC registered DDR5 modules have no scheduled replacement interval; they remain in service until a correctable error becomes uncorrectable or the system requires more capacity.
The memory controller’s maximum supported speed and the module’s CL40 latency set the throughput ceiling before thermal or power limits are reached.
At 1.1 V the module draws only a few watts and has no heat spreader, so it adds minimal heat to the chassis airflow.
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