OWC 1S6D31R804GB 4GB DDR3 1600 CL11 1.5V SODIMM memory upgrade
- 4GB
- 204-Pin DDR3 Non-EC…
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OWC
4GB DDR3 1600 CL11 SODIMM upgrades HP Omni 27 systems with 1.5V non-ECC memory
This OWC module adds 4 GB of DDR3-1600 memory to HP Omni 27 all-in-one desktops that use DDR3 SODIMM slots. It runs at the standard 1.5 V with CL11 latency and follows JEDEC PC3-12800 specifications. The single-rank 1Rx8 design fits the 204-pin socket without a heat spreader. Installation is a straightforward DIY task for most owners.
The module suits owners of compatible HP Omni 27 systems who need a single 4 GB stick to fill an empty slot or replace a failed one. Builders whose machines require ECC, registered, 1.35 V low-voltage or a different pin-count memory cannot use this part. It also does not serve systems that accept only higher-density or dual-rank configurations.
The decisive specification is the 204-pin DDR3-1600 CL11 1.5 V unbuffered non-ECC SODIMM form factor. Matching this exact combination of pin count, voltage, speed and latency ensures the module will be recognised and run stably in the supported HP Omni 27 platforms.
| Brand | OWC |
|---|---|
| Part Number | 1S6D31R804GB |
| Capacity | 4GB |
| Type | 204-Pin DDR3 Non-ECC SODIMM |
| Speed | DDR3 1600 (PC3 12800) |
| CAS Latency | CL11 |
| Voltage | 1.5V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Rank | 1Rx8 |
| Heat Spreader | No |
| Compatible System | HP Omni 27 Series using DDR3 Memory |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
Power off and unplug the HP Omni 27, open the memory access panel, align the notch on the 204-pin DDR3 SODIMM with the slot key, press firmly until the side clips click, then close the panel; the step often missed is pressing hard enough to engage both retention clips fully.
No routine maintenance is required for the non-ECC unbuffered SODIMM; replacement is only necessary if a memory test reports errors or if you upgrade to a higher capacity supported by the HP Omni 27 series.
The thermal limit of the DRAM chips without a heat spreader is reached first, causing the module to throttle or the system to reduce memory speed to stay within safe operating temperature.
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